Chemical liquid circulation heater

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Chemical liquid circulation heater

No metal ion dissolution pollution, online heating type chemical liquid heating equipment

  • Product Features
  • Product Specification
  • Product Usage
    • Commodity name: Chemical liquid circulation heater

    No metal ion dissolution pollution, online heating type chemical liquid heating equipment

    1. The heating part is made of high-purity glass carbon material, without metal ion dissolution. No surface protection film is required during wafer processing, which reduces the process and improves efficiency.

    The independently developed O-ring structure can cope with acids, alkalis, and organic solutions.
    2. It has built-in leak detection and temperature abnormality detection functions, and the temperature switch is built-in, which can automatically shut down to achieve safe use.

  • Heating machine CHE-36-3-S
    Controller AIC-7-CH6-S
    Heating method Exchangeable resistor heater heating, the processing tank is directly circulated with the online pipe
    Temperature setting range 25℃~80℃ depends on the actual environment and type of medicine
    Temperature control accuracy ±0.5℃ (when the set temperature is 50-80℃)
    Heater power consumption 6KW
    Temperature control method PID control, automatic tuning function
    Temperature setting method Up and down key settings
    Temperature representation 4-digit number representation (minimum 0.1℃)
    Liquid material for circulation system Fluorinated resin, high-purity glass carbon material is used in the thermal contact surface
    The circulation system allows internal pressure 0.3MPa
    Circulating flow 15 (L/min) or above
    Safety features Automatic diagnosis function, power output stops and alarms after detection
    External communication RS232C
    Heating machine size W380×D350×H325 About 38kg
    Controller size w145×D235×H213 About 5.2kg
    Circulation system pipe diameter PFA pipe (outer diameter 3/4″×inner diameter 5/8″)
    Power supply (50/60Hz) AC single phase 200V/30A
  • 1. Temperature management of various chemical solutions for wafer processing in semiconductor processing  · Polymer material removal solution

    • RCA cleaning solution
    • Etching solution
    • Developer

    2. Electroplating solution, various surface treatment solutions

    • Acidic solution (fluoric acid, nitric acid, etc.)
    • Alkaline solution (NaOH, KOH, etc.)
    • Organic solution