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Corrosion Equipment
In the semiconductor manufacturing process, etching equipment is one of the key steps to remove impurities and unnecessary parts of the surface of the silicon wafer. The design and operation of corrosion equipment requires strict control of environmental conditions, such as temperature, humidity and cleanliness, to ensure product quality and stability.
Wet etching equipment
The selective etching of the surface of the silicon wafer is mainly achieved by chemical solution.
This method can accurately control the depth and shape of the corrosion, and is suitable for the production of complex patterns.
The chemical solution used in the wet etching process includes hydrofluoric acid, nitric acid and other highly corrosive liquids.
The equipment is usually equipped with a temperature control system to ensure that the chemical reaction is carried out under constant conditions.
SPM is a commonly used wet chemical solution for photoresist stripping
KOH etching of silicon wafers depends on the concentration and temperature of the solution
Fully automatic etching machine
Etching has become a crucial step in semiconductor wafer manufacturing
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