Samsung initiates R&D for 1nm process technology, aiming for mass production by 2029

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Industry News

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2025-04-10

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According to reports on April 9th, Samsung Electronics has begun developing a 1nm (nanometer, one billionth of a meter) wafer fabrication process. Due to the existing gap with TSMC in technologies such as the soon-to-be mass-produced 2nm process, Samsung Electronics plans to accelerate the development of the 1nm process to create an opportunity for a turnaround.

According to industry sources on the 9th, Samsung Electronics' semiconductor research institute recently launched the development of the 1nm process. A project team has been formed, comprised of researchers involved in the development of cutting-edge processes such as 2nm. In Samsung Electronics' currently publicly available wafer fabrication process roadmap, the 1.4nm process, scheduled for mass production in 2027, is the most advanced.

The 1nm process requires new technological concepts that break the existing design framework, as well as the introduction of next-generation equipment such as high-numerical-aperture extreme ultraviolet lithography (High-NA EUV) steppers. Reports indicate that Samsung plans to set mass production for after 2029.

In the 3nm process currently in mass production at Samsung Electronics and the 2nm process scheduled for mass production this year, Samsung's technology lags behind TSMC. Especially in the 2nm area, TSMC's yield rate has exceeded 60%, a significant gap from Samsung Electronics, therefore the development of the 1nm process has been started early.

Meanwhile, Samsung's competitors are also accelerating the development of 1nm-class processes. TSMC announced last April that it will begin production of 1.6nm (16A) technology, between 1.4nm and 2nm, in the second half of 2026. This move is seen as a response to the technological needs of the rapidly changing artificial intelligence (AI) semiconductor market and as building a bridge to next-generation processes.

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