Process Technology

Oct 21,2026

The difference between CLEAN-PVC and UPVC

CLEAN-PVC and UPVC both belong to the rigid PVC-U family in terms of material composition, but they differ significantly in aspects such as formulation purity, control of metallic stabilizers, extractables levels, processing and factory‑out handling, applicable water quality, and cost.

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The difference between CLEAN-PVC and UPVC

Sep 24,2026

Advanced Cleaning Technologies for Specific Contaminants: SPM and Thermal Phosphoric Acid

SPM, with its unparalleled strong oxidizing power, is specifically designed to thoroughly eliminate organic contamination; meanwhile, hot phosphoric acid, owing to its exceptional selective etching capability, serves as an effective tool for precisely removing silicon nitride materials.

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Advanced Cleaning Technologies for Specific Contaminants: SPM and Thermal Phosphoric Acid

Sep 21,2026

Classic RCA Cleaning Technology

This section focuses on the classic foundation of semiconductor wet cleaning: RCA cleaning technology. Developed by the RCA Laboratories in 1970, it has remained the standard process in fabs worldwide for more than half a century. The article provides a detailed analysis of the mechanisms and respective roles of its core formulations—SC‑1, SC‑2, and DHF—revealing the scientific rationale behind this time-tested “time-honored recipe.”

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Sep 14,2026

Overview and Core Principles of Semiconductor Wet Cleaning

In the semiconductor manufacturing industry, there is a widely held belief: “Three parts of chip performance depend on fabrication, while seven parts depend on cleaning.”

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Overview and Core Principles of Semiconductor Wet Cleaning

Sep 04,2026

Core Performance of PFA

PFA (perfluoroalkoxy polymer) is a high‑end fluoroplastic, specifically engineered to address the challenges of corrosion and contamination posed by ultra‑high‑purity chemicals. It retains PTFE’s exceptional chemical inertness while overcoming PTFE’s inherent processing difficulties.

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Aug 17,2026

The difference between PTFE and PFA

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Aug 11,2026

Wet cleaning equipment

Wet‑cleaning equipment serves semiconductor wafer fabrication, integrated circuit packaging and testing, MEMS (micro‑electromechanical systems), optoelectronic devices, nanomaterial synthesis, and other applications, where it is used to remove particles, organic residues, metallic contaminants, and native oxide layers from the surfaces of chips and substrates.

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Jul 27,2026

Application of Megasonic Cleaning Technology Throughout the Entire Wafer Manufacturing Process

Megasonic Cleaning is a critical wet‑process cleaning technology in advanced semiconductor manufacturing. By generating cavitation and acoustic streaming in the cleaning solution through high‑frequency sound waves—typically in the range of 0.8 to 2 MHz—it achieves highly efficient removal of sub‑micron particles, organic residues, and metallic contaminants from wafer surfaces.

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Application of Megasonic Cleaning Technology Throughout the Entire Wafer Manufacturing Process

Jul 06,2026

Principle and Parameter Control of the SC-1 Cleaning Process

SC‑1 (Standard Cleaning 1) is one of the most critical steps in semiconductor wet‑process cleaning. At its core, it employs an NH₄OH/H₂O₂/deionized water mixture that relies on the synergistic effects of oxidation and etching to remove particulates and organic contaminants.

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Principle and Parameter Control of the SC-1 Cleaning Process

Jun 15,2026

Process Control and Safety Precautions for SC-2 Cleaning Solution

SC-2 cleaning solution (a strong acid–strong oxidant mixture) plays a critical role in semiconductor wet‑process cleaning, but it suffers from a narrow process window and high safety risks.

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Process Control and Safety Precautions for SC-2 Cleaning Solution

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