Process Technology

Sep 04,2026

PFA (perfluoroalkoxy polymer) is a high‑end fluoroplastic, specifically engineered to address the challenges of corrosion and contamination posed by ultra‑high‑purity chemicals. It retains PTFE’s exceptional chemical inertness while overcoming PTFE’s inherent processing difficulties.

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Aug 17,2026

The difference between PTFE and PFA

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Aug 11,2026

Wet cleaning equipment

Wet‑cleaning equipment serves semiconductor wafer fabrication, integrated circuit packaging and testing, MEMS (micro‑electromechanical systems), optoelectronic devices, nanomaterial synthesis, and other applications, where it is used to remove particles, organic residues, metallic contaminants, and native oxide layers from the surfaces of chips and substrates.

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Jul 27,2026

Application of Megasonic Cleaning Technology Throughout the Entire Wafer Manufacturing Process

Megasonic Cleaning is a critical wet‑process cleaning technology in advanced semiconductor manufacturing. By generating cavitation and acoustic streaming in the cleaning solution through high‑frequency sound waves—typically in the range of 0.8 to 2 MHz—it achieves highly efficient removal of sub‑micron particles, organic residues, and metallic contaminants from wafer surfaces.

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Application of Megasonic Cleaning Technology Throughout the Entire Wafer Manufacturing Process

Jul 06,2026

Principle and Parameter Control of the SC-1 Cleaning Process

SC‑1 (Standard Cleaning 1) is one of the most critical steps in semiconductor wet‑process cleaning. At its core, it employs an NH₄OH/H₂O₂/deionized water mixture that relies on the synergistic effects of oxidation and etching to remove particulates and organic contaminants.

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Principle and Parameter Control of the SC-1 Cleaning Process

Jun 15,2026

Process Control and Safety Precautions for SC-2 Cleaning Solution

SC-2 cleaning solution (a strong acid–strong oxidant mixture) plays a critical role in semiconductor wet‑process cleaning, but it suffers from a narrow process window and high safety risks.

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Process Control and Safety Precautions for SC-2 Cleaning Solution

Jun 08,2026

Metal Removal Mechanism of SC-2 Cleaning Solution

SC-2 cleaning solution (an HCl/H₂O₂/H₂O mixed system) leverages a triple synergistic mechanism—oxidation, complexation, and acid inhibition—to efficiently remove metallic contaminants from silicon wafer surfaces, achieving removal rates exceeding 99.99%.

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Metal Removal Mechanism of SC-2 Cleaning Solution

May 26,2026

SC-1 Cleaning Solution

SC-1 (Standard Clean 1) is a core step in the RCA cleaning process, formulated by mixing NH₄OH, H₂O₂, and H₂O in specific proportions.

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May 22,2026

Process Control and Safety in SPM

SPM (sulfuric acid–hydrogen peroxide mixture) is a highly oxidizing cleaning solution commonly used in semiconductor manufacturing, and its process control as well as safety and environmental management are of paramount importance.

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May 20,2026

SC-2 Cleaning Solution

SC-2 cleaning solution is one of the core steps in the RCA standard cleaning process, introduced by the U.S. company RCA in 1970 and specifically designed to remove alkali metal ions and heavy metal impurities from the surface of semiconductor wafers.

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