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SPM cleaning process
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Process Technology
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Release time:
2025-04-30
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What is the SPM cleaning process?
The SPM (sulfuric acid/hydrogen peroxide mixture) cleaning process is a commonly used wet chemical cleaning method in semiconductor manufacturing, mainly used to remove organic contaminants (such as photoresist, grease) and inorganic contaminants (such as metal ions) from the surface of silicon wafers. Its core is to achieve efficient cleaning through the synergistic effect of the strong oxidizing properties of sulfuric acid and hydrogen peroxide.
I. Cleaning Principle
Chemical Reaction: The SPM (sulfuric acid/hydrogen peroxide mixture) cleaning process utilizes the strong oxidizing property of sulfuric acid and the reducing property of hydrogen peroxide to remove contaminants from the surface of the silicon wafer through chemical reactions. Sulfuric acid can decompose organic substances, while hydrogen peroxide helps to remove inorganic substances.
Surface Active Effect: The surfactant in the SPM solution can reduce the surface tension between the liquid and the solid, allowing the cleaning solution to better wet the surface of the silicon wafer, thereby improving the cleaning effect.
II. Temperature Conditions
SPM cleaning is usually carried out at a higher temperature, generally between 120 and 150℃. High temperature can accelerate the chemical reaction rate, improve cleaning efficiency, and help remove difficult-to-remove contaminants.
III. Cleaning Steps
Pretreatment: Immerse the silicon wafer in optically pure deionized water to remove large particulate impurities and loose attachments.
SPM Cleaning: Transfer the silicon wafer to the SPM solution tank, control the temperature (select 80-90℃ or 120-150℃ as needed) and time (5-15 minutes). The solution fully wets the surface of the silicon wafer, decomposing contaminants through chemical reactions.
Intermediate Rinse: Rinse with optically pure deionized water to remove residual SPM solution and reaction products.
Post-treatment: Further immerse in deionized water or a special cleaning solution (such as SC1, SC2) to ensure no residue.
Drying: Remove surface moisture using methods such as spin drying, nitrogen drying, or infrared drying.
IV. Precautions
Safe Operation: The SPM solution is highly corrosive and strongly oxidizing, so necessary safety measures must be taken during operation, such as wearing protective gloves and goggles.
Equipment Maintenance: Regularly maintain and service the cleaning equipment to ensure normal operation and stable cleaning efficiency.
Quality Control: During the cleaning process, it is necessary to strictly control cleaning parameters (such as time, temperature, solution concentration, etc.) to ensure that the cleaned silicon wafers have good quality and performance.
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