EKC solution cleaning process

Category:

Process Technology

Author:

Source:

Release time:

2025-07-07

Visits:

EKC solution cleaning is a crucial step in semiconductor manufacturing used to remove residues and contaminants from the wafer surface. Below is a detailed description of the EKC solution cleaning process:

Pre-treatment: Before EKC solution cleaning, wafers typically undergo pre-treatment, including acid washing and deionized water rinsing, to remove large particulate matter and initial contaminants from the surface.

Acid washing: Acid washing uses an acidic solution (such as sulfuric acid, nitric acid, etc.) to etch the wafer surface, removing the oxide layer and some metallic impurities. The acid washing time and temperature depend on the specific situation; it is generally performed at room temperature for several minutes to over ten minutes.

EKC solution cleaning: The pre-treated wafer is placed in a cleaning tank containing EKC solution and cleaned under specific temperature and time conditions. The main components of EKC solution include hydroxylamine (such as hydroxylamine, potassium hydroxide, sodium hydroxide, etc.), organic acids (such as citric acid, oxalic acid, etc.), surfactants (such as polyether silicone oil), and deionized water. These components work together to effectively remove polymers, metal ions, and other organic contaminants from the wafer surface. The cleaning time is generally 20 to 30 minutes, with the temperature controlled at around 90°C.

Deionized water rinsing: After cleaning, the wafer is thoroughly rinsed with deionized water to remove residual EKC solution and loosened contaminants. The purity of the deionized water is very high to avoid introducing new impurities.

Drying: The rinsed wafer is dried, usually using spin drying or nitrogen blowing. The drying time is generally around 5 minutes to ensure the wafer surface is completely dry.

Post-treatment: Depending on the needs, further post-treatment steps may be required, such as polishing and inspection, to ensure that the cleanliness and flatness of the wafer surface meet the requirements of subsequent processes.

Kexin Microelectronics Co., Ltd. - Leading the Innovation of Semiconductor Cleaning Technology

For more technical details, please contact our technical consultant: 13861996325!

▲Technical Consultation ▲Follow Kexin Microelectronics WeChat Official Account

EKC,EKC solution,Cleaning process

Pre

Semiconductor Cleaning: Processes, Methods, and Principles

Advantages of wet etching

Semiconductor Cleaning: Processes, Methods, and Principles

Advantages of wet etching

COOKIES

Our website uses cookies and similar technologies to personalize the advertising shown to you and to help you get the best experience on our website. For more information, see our Privacy & Cookie Policy

COOKIES

required

These cookies are necessary for basic functions such as payment. Standard cookies cannot be turned off and do not store any of your information.

analyze

These cookies collect information, such as how many people are using our site or which pages are popular, to help us improve the customer experience. Turning these cookies off will mean we can't collect information to improve your experience.

Feature

These cookies enable the website to provide enhanced functionality and personalization. They may be set by us or by third-party providers whose services we have added to our pages. If you do not allow these cookies, some or all of these services may not function properly.

advertise

These cookies help us understand what you are interested in so that we can show you relevant advertising on other websites. Turning these cookies off will mean we are unable to show you any personalized advertising.

Business License