Xihu Instruments: New breakthrough in ultra-thin single crystal diamond processing technology!

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Industry News

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2025-07-08

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Recently, Xihu Instruments announced a breakthrough in ultrathin single-crystal diamond exfoliation technology, successfully exfoliating single-crystal diamond ultrathin films with a thickness of <100μm. This technology brings a revolutionary innovation to the field of single-crystal diamond processing, not only greatly reducing production costs but also significantly improving processing efficiency. It lays the foundation for the wide application of ultrathin single-crystal diamond in various cutting-edge technological fields such as high-end electronics, quantum technology, and high-end optical windows.

Ultrathin single-crystal diamond

Xihu Instruments' laser-assisted dicing technology uses lasers for contactless modification processing within the material. It precisely controls the laser's interaction point within the material, enabling the separation of ultrathin single-crystal diamond wafers. This technology is compatible with various processing sizes, boasts high slicing efficiency, and minimizes material loss. Regardless of whether processing 1-inch or future 4-inch, 6-inch diamonds, material loss is consistently controlled to 100μm or less; compared to traditional laser exfoliation, this technology significantly improves processing efficiency, taking <30min to process a 1-inch wafer, for example.

Application Prospects of Ultrathin Single-Crystal Diamond

High-end Electronics: Diamond-based high-power devices (such as SBD, FET), thermal management materials (such as diamond heat sinks, GaN-on-Diamond), and high-frequency radio frequency devices.

Optoelectronic Display: Precision optical measurement, high-power laser processing equipment, and optical window materials for chemical process monitoring in extreme environments.

Quantum Technology: Quantum sensors based on diamond NV centers, quantum computing, etc.

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