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Eight major integrated circuit projects, including the expansion of China Resources' testing and packaging capacity, with a total investment of 4.25 billion yuan, have been signed in Chongqing.
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Industry News
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Release time:
2025-07-29
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According to Chongqing High-tech Zone Media Center, on July 28, eight leading enterprises in the integrated circuit field signed a concentrated agreement with Chongqing High-tech Zone, with a total investment of 4.25 billion yuan.
The signed projects include the Huarun Packaging and Testing Capacity Expansion Project, the Dongwei Electronics Semiconductor Equipment Southwest Headquarters Project, the Xinyaohui Semiconductor Domestic Advanced Process IP R&D Center Project, the SiDa Semiconductor IPM Module Manufacturing Project, the Xinlianxin Integrated Circuit Public Design Service Platform Project, the Jifen Semiconductor Packaging and Testing Project, the Ruixin Semiconductor Chip Design and Testing Headquarters Project, and the Mite Technology Silicon Photonics Integrated Chip Fiber Optic Gyroscope Project.
In this signing, the eight leading enterprises build an industrial chain around the upstream and downstream of the integrated circuit industry chain. For example, Xinyaohui Technology Co., Ltd. focuses on the independent research and development, authorization, and service of semiconductor high-speed interconnection technology and advanced semiconductor IP; the Dongwei Electronics Semiconductor Equipment Southwest Headquarters Project produces equipment, materials, and components for integrated circuit manufacturing; and the Jifen Semiconductor Packaging and Testing Project is dedicated to the research and development and manufacturing of AI intelligent power modules and MEMS sensor modules.
Among them, the Ruixin Semiconductor Chip Design and Testing Headquarters Project, with an investment of 500 million yuan, will establish an advanced design and testing headquarters in Chongqing High-tech Zone, providing services such as "testing, benchmarking, analysis, experimentation, certification, and wafer fabrication" for semiconductor companies in Southwest China, and providing operation and market-oriented services for universities with semiconductor equipment instruments. The project is planned to start construction in 2026 and be put into operation in March 2027. It is expected to achieve an annual operating income of 25 million yuan in the year of commissioning and 150 million yuan in 2030.
SiDa Semiconductor Co., Ltd. signed an agreement to establish SiDa Semiconductor (Chongqing) Co., Ltd., using approximately 35 mu of industrial land to build an IPM (Intelligent Power Module) production line. The project is planned to start construction in 2026 and go into production in 2028, achieving an annual output value of 50 million yuan that year. The workforce is expected to reach approximately 200 people after reaching full production capacity, with an annual output value of 500 million yuan by 2031.
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