Jingce Electronics has completed construction of its 12-inch advanced packaging R&D line and has begun investing in the expansion project for its Shanghai Phase II laboratory.

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2026-01-30

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Recently, Wuhan Jingce Electronic Group Co., Ltd. (hereinafter referred to as “Jingce Electronic”) stated in its investor relations activity record that the company is actively pursuing a strategic layout in advanced packaging technologies. By increasing its investment, Jingce Electronic has acquired a 33.6414% stake in Hubei Xingchen Technology Co., Ltd. (hereinafter referred to as “Hubei Xingchen”), thereby deepening its strategic cooperation and strengthening its ties with key customers including Hubei Xingchen.

At this stage, Hubei Xingchen has already built a domestically leading advanced packaging R&D line for 12-inch integrated circuits. The core processes have been fully established, enabling us to provide customers with one-stop, comprehensive advanced packaging solutions. Currently, we have entered the customer introduction phase. Meanwhile, in response to market demand, we are actively planning and constructing the second-phase R&D project.

The company’s expansion in the semiconductor industry—from front-end metrology equipment to the semiconductor manufacturing and packaging value chain—will enable it to seize the historic opportunities presented by the rapid growth of data centers, supercomputing, and the AI industry. At the same time, this move will boost the company’s semiconductor business and is of great significance for its long-term development.

In addition, to accelerate the iterative upgrade toward more advanced process technologies, enhance our overall R&D capabilities and competitive strength, and further implement our future development strategy, the company’s holding subsidiary, Shanghai Jingce, plans to acquire the land-use rights for Plot F2-05 in the Shixi Software and Information Park, Qingpu District, Shanghai, and invest in the construction of the second-phase laboratory expansion project for Shanghai Jingce Semiconductor Technology Co., Ltd. The total planned investment for this project is approximately RMB 350 million.

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