Etching emphasizes “control,” while cleaning emphasizes “purity”—differences in the core module configurations of wet etchers and wet cleaners

Due to the fundamental differences in process objectives and evaluation metrics between wet etching and wet cleaning, their equipment architectures exhibit distinct divergences. Wet etching equipment is primarily focused on precise control of the etching process, whereas wet cleaning equipment centers on efficient contamination removal and prevention of cross-contamination.

I. Core Structural Features of Wet Etching Machines

• High-precision temperature-controlled etching tank: Equipped with a sophisticated temperature-control system to ensure stable etching rates; the tank material is resistant to strong acids and bases and features excellent sealing. This module directly guarantees the controllability and uniformity of the etching rate.
• Etchant Circulation and Concentration Compensation System: This system continuously monitors the etchant concentration in real time and automatically replenishes with fresh etchant; a high-precision flow meter precisely controls the circulation rate, ensuring uniform etching across the wafer surface. This module is critical for controlling etch uniformity and minimizing lateral undercut deviations.
• Mask-compatible fixture and endpoint detection module: The fixture is compatible with various types of photoresist masks, hard masks, and other mask formats; the endpoint detection module monitors the etching process in real time and automatically stops when the target material has been completely removed, thereby preventing over-etching. This module directly enhances pattern accuracy and protects the mask material.
• Dedicated drying module: employs IPA drying or spin drying to prevent residual etchant and pattern collapse, thereby avoiding pattern damage caused by liquid surface tension.

II. Core Structural Features of Wet Cleaning Machines

• Multi-tank serial cleaning system: sequentially performs chemical cleaning, ultrapure water rinsing, and drying, with isolation structures between tanks to prevent cross-contamination. This design is intended to maximize particle removal efficiency and minimize metal and organic residues.
• Contaminant Stripping Auxiliary Module: Integrates ultrasonic, megasonic, or rotary spray devices to enhance particle removal efficiency through cavitation effects or physical scouring. This module directly improves particle removal rates while minimizing the formation of surface defects such as scratches.
• High-purity water rinsing and recirculating filtration system: Equipped with a deionized water system and a recirculating filtration unit to remove particulates from the rinse water, thereby preventing secondary contamination. This module ensures that post-cleaning surface metal residues are reduced to the ppb level and organic residue is minimized to near zero.
• Anti-cross-contamination design: An automated liquid-exchange system or single-wafer cleaning mode is employed to completely eliminate cross-contamination between adjacent processing chambers. This design effectively reduces the density of surface defects, thereby meeting the requirements of high-precision manufacturing.

Conclusion

The architecture of wet etching equipment is designed with “precise termination” as the guiding principle—temperature control, concentration compensation, and endpoint detection modules work in concert to ensure that etching stops precisely at the predefined boundary. In contrast, wet cleaning equipment is engineered for “thorough cleanliness”—multi-tank series configuration, auxiliary stripping, recirculating filtration, and cross-contamination prevention features collectively deliver high-efficiency dirt removal and ultra-low residue levels. The differences in module configuration between these two types of equipment directly support their distinct performance evaluation frameworks.

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