SC-1 Cleaning Solution

Category:

Process Technology

Author:

Source:

Release time:

2026-05-26

Visits:

During semiconductor chip manufacturing, contaminants on the silicon wafer surface—such as particles, organic residues, and metal ions—can severely degrade device performance and yield. Wet chemical cleaning is the primary method for removing these contaminants, with the RCA cleaning process having served as the industry standard since the 1960s. As the first step in the RCA sequence, SC‑1 plays a critical role in eliminating particles and organic matter. Despite being introduced nearly six decades ago, SC‑1 remains the “gold standard” on production lines today.

I. Basic Definition and Formulation of SC-1

SC-1 is a mixed solution composed of ammonium hydroxide (NH₄OH), hydrogen peroxide (H₂O₂), and deionized water (H₂O). The conventional volumetric ratio is:

NH₄OH : H₂O₂ : H₂O = 1 : 1 : 5

In practical processes, the formulation can be adjusted to a ratio of 1:1:7 to 1:2:10 depending on the desired corrosion rate. The operating temperature is typically maintained between 65 and 80 °C; within this range, cleaning efficiency and wafer surface damage are optimized.

II. Core Mechanism of Action

The cleaning performance of SC-1 relies on the synergistic action of two primary components:

NH₄OH provides an alkaline environment (pH ≈ 10–11), inducing mild oxidation and micro‑etching on the silicon surface, thereby “lifting” adsorbed particulates from the surface.
As a strong oxidizing agent, H₂O₂ continuously forms a chemically oxidized film approximately 1 nm thick on the silicon surface, effectively suppressing the re-adsorption of metal ions.

The alternating cyclic action of “corrosion–re-oxidation” results in a particle desorption efficiency far exceeding that of any single-component cleaning solution.

The primary targets of SC-1 include organic contaminants, particulates, and certain contaminants on the natural oxide layer.

III. Conclusion

As a simple yet highly effective alkaline cleaning solution, SC‑1 has maintained its dominant position in semiconductor wet‑process cleaning for six decades, thanks to its unique synergistic oxidation–corrosion mechanism. Even as advanced manufacturing processes continue to evolve, SC‑1 remains the preferred choice for particle removal, with its classic formulation and process conditions undergoing ongoing optimization to meet the demands of new materials and device architectures.

For more technical details, please contact our technical consultant at 13861996325!

▲Technical Consultation ▲Follow the Kexinwei WeChat Official Account

SC1,RCA

Pre

Metal Removal Mechanism of SC-2 Cleaning Solution

Process Control and Safety in SPM

Metal Removal Mechanism of SC-2 Cleaning Solution

Process Control and Safety in SPM

COOKIES

Our website uses cookies and similar technologies to personalize the advertising shown to you and to help you get the best experience on our website. For more information, see our Privacy & Cookie Policy

COOKIES

required

These cookies are necessary for basic functions such as payment. Standard cookies cannot be turned off and do not store any of your information.

analyze

These cookies collect information, such as how many people are using our site or which pages are popular, to help us improve the customer experience. Turning these cookies off will mean we can't collect information to improve your experience.

Feature

These cookies enable the website to provide enhanced functionality and personalization. They may be set by us or by third-party providers whose services we have added to our pages. If you do not allow these cookies, some or all of these services may not function properly.

advertise

These cookies help us understand what you are interested in so that we can show you relevant advertising on other websites. Turning these cookies off will mean we are unable to show you any personalized advertising.

Business License