Xinye Era’s first 8-inch chip production line in Northwest China has entered operation, with a yield rate exceeding 95%.

According to the Shaanxi Daily, the first phase of the 8-inch high-performance specialty‑process semiconductor production line project at Shaanxi Electronics Xinye Shidai Technology Co., Ltd. officially entered commercial operation at the end of 2025, marking the first completed and commissioned 8-inch chip production line in Northwest China. As of June 2026, the line’s product yield has exceeded 95%, and Phase II construction is scheduled to commence in the third quarter of 2026, with plans to further expand production capacity.

The project is being developed by Shaanxi Electronic Information Group as the investing entity and is located in the Xi’an High-tech Comprehensive Bonded Zone. With a total investment of RMB 4.5 billion, Phase I has already secured RMB 3.2 billion in funding. Construction commenced in May 2024; the first piece of process equipment was moved in March 2025, electrical commissioning was completed in mid-August, and trial production began at the end of September, reflecting an efficiently managed construction schedule. The production line occupies a total floor area of 173,900 square meters, comprising 17 individual buildings, including manufacturing facilities and a central power station. It is designed to achieve a monthly capacity of 50,000 wafers, with potential to expand to 100,000–150,000 wafers per month in the future.

According to official disclosures from Xinye Shidai, the cleanroom environment and the plant’s utility‑power systems have both been brought into compliance and are now in operation. Equipment commissioning in core process areas such as lithography and etching has been fully completed, and the company has already achieved the production and sale of several thousand wafers. Since 2026, the company has signed bulk‑order agreements with 13 leading industry players, with market order execution progressing steadily.

The production line is being built with both domestic localization and forward-looking planning in mind. The localization rate for core process equipment exceeds 60%, while that for auxiliary machinery and components approaches 90%, placing the company at the forefront of independent control over critical equipment. Meanwhile, more than 80% of the production equipment is compatible with the R&D and manufacturing of third-generation semiconductors, paving the way for the large-scale deployment of cutting-edge technologies such as silicon carbide. Furthermore, the facility’s infrastructure is designed to accommodate future expansion to a 12-inch production line, ensuring long-term upgradeability.

The project focuses on industrial‑grade and automotive‑grade power devices, with products spanning IGBTs and high‑voltage, high‑capacity wafers, directly serving sectors such as new‑energy vehicles, renewable‑energy storage, and AI‑driven data centers, thereby helping to reduce reliance on imported high‑end chips. During the 15th Five‑Year Plan period, Xinye Shidai plans a total investment of RMB 19 billion, progressively advancing the development of specialized process platforms and establishing a manufacturing ecosystem that covers 8‑inch to 12‑inch fabs, integrating both silicon‑based and compound‑semiconductor technologies.

Regarding the second-phase construction, XinYe Shidai stated that, building on the stable mass production achieved in the first phase, it will officially commence in the third quarter of 2026. The company will continue to advance its “build‑while‑research‑while‑produce‑while‑expand” model, further strengthening its competitive edge in semiconductor manufacturing capacity in Northwest China and accelerating the localization of the industry.