Wet cleaning equipment

Category:

Process Technology

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Release time:

2026-08-11

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I. Application Areas

Wet‑cleaning equipment serves semiconductor wafer fabrication, integrated circuit packaging and testing, MEMS (micro‑electromechanical systems), optoelectronic devices, and nanomaterial synthesis, among other applications, and is used to remove particles, organic residues, metallic contaminants, and native oxide layers from chip and substrate surfaces.

II. Operating Principle
Employing a synergistic effect of chemical dissolution and physical flushing:

Chemically: Specific-formulation cleaning solutions (such as SC‑1, SC‑2, and dilute hydrofluoric acid) react with surface contaminants, converting them into soluble forms or states that can be easily removed.

From a physical standpoint: high-pressure spray rinsing, megasonic vibration, or rotary scouring are employed to accelerate the diffusion and removal of reaction products; the surface is then rinsed with deionized water and dried, yielding an atomically clean surface.

III. Structural Composition

Main components of the equipment

Cleaning chamber (carries wafers/chips)
Spray system (precise chemical liquid distribution)
Chemical Solution Supply and Recovery Circulation System
Circulating filtration system (maintains the cleanliness of the pharmaceutical solution)
Drying system (commonly using hot nitrogen gas or centrifugal spin-drying)
Temperature/Concentration Online Monitoring Module

IV. Performance Characteristics

Core Competencies	Particle removal efficiency exceeds 99.9%, surface metal contamination is controlled to the ppb level, and no damage is inflicted on wafer patterns.
Capacity/efficiency	Typically batch‑type or single‑piece‑per‑batch, with processing times on the order of minutes and relatively limited throughput.
Level of intelligence	Relying on recipe management and automated endpoint detection, with partial integration of AI vision for predictive assessment of cleaning quality.
Environmental and Technological Challenges	It generates large quantities of waste acid, wastewater, and harmful gases (such as volatile HF), necessitating the installation of accompanying exhaust gas scrubbing and waste liquid treatment facilities.
Maintenance costs	Consumables (filter cartridges, chemical solutions) are heavily consumed, and the chamber requires regular cleaning and maintenance.

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Wet cleaning equipment,Semiconductor,Wafer

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