With a total investment of RMB 290 million, the main structure of Xinqing Optoelectronics’ Tianjin industrial base has been topped out.

Recently, the construction of the optoelectronics industrial base of Tianjin Xinqing Technology Co., Ltd.—a key project in the Sino‑Singapore Tianjin Eco‑City—has entered full‑speed mode. The project is expected to complete construction by September this year and officially begin operations in October.

The project has a total investment of RMB 290 million and a total floor area of 51,000 square meters. It will establish an R&D and production base for optoelectronic integrated devices, covering the entire industrial chain—from chip R&D and design to manufacturing, packaging, testing, and downstream product incubation. Upon completion and commissioning, the facility will have an annual production capacity of 125,000 optoelectronic chips and 75,000 units of optoelectronic device packages.

At the project’s construction site, reporters observed that all buildings under construction have completed their structural topping-out; in most structures, secondary‑structure work is progressing smoothly, while finishing tasks such as floor leveling and exterior‑facade cladding are being expedited. According to Zhang Yingjie, head of the Tianjin Xinqing Optoelectronics Industrial Base, core ancillary systems—including doors and windows, elevators, central air conditioning, and cleanrooms—are being delivered and installed in stages, with all construction activities advancing steadily according to the established schedule.

According to reports, Tianjin Xinqing Technology’s core technologies originate from Tianjin Jianhe Bafang Optoelectronics Technology Co., Ltd., an incubated enterprise of the Tsinghua University Tianjin Institute of Electronic Information. The company has been relentlessly advancing silicon‑based optoelectronic integration technologies, addressing the limitations of conventional optoelectronic devices and achieving a high degree of integration of key components. As downstream market demand expands rapidly, the company has launched large‑scale capacity expansion projects, seizing opportunities in the domestic substitution market for high‑end optoelectronic chips.

“As the application scenarios for optoelectronic chips continue to expand, industry demand is experiencing explosive growth, and the shortage of high-end chip production capacity has become increasingly pronounced, creating a golden window for domestic chips to achieve substitution,” said Zhang Yingjie.

Upon completion, this optoelectronics industrial base will significantly bolster the intelligent manufacturing capabilities of the Beijing–Tianjin–Hebei region’s optoelectronics sector, address critical gaps in the integrated circuit industry chain, and drive the local R&D and manufacturing of optoelectronic chips toward higher‑end, large‑scale development. At the same time, the project will attract a concentration of technical talent and facilitate the establishment of upstream and downstream industries, further enhancing the region’s collaborative innovation capacity and its ability to ensure independent and controllable access to key links in the industrial and supply chains.