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SEMI Report: As construction accelerates, global equipment spending for 300mm wafer fabs is forecast to reach US$227 billion by 2029.
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Industry News
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Release time:
2026-10-19
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On October 13, 2026, U.S. Pacific Time, SEMI released its latest “300mm Fab Outlook” report at SEMICON West, projecting that global capital spending on front-end 300mm fab equipment will reach US$149 billion in 2026, up 31% year over year. The report further forecasts that this investment will maintain double-digit growth through 2029, climbing to US$227 billion.
As investment continues to grow, new 300mm fabs and production lines around the world are steadily transitioning from the construction phase to operations. Excluding dedicated R&D fabs, SEMI forecasts that globally, 20 and 18 new 300mm fabs or production lines will begin construction in 2026 and 2027, respectively. Among these, the United States is expected to break ground on three facilities in 2026 and four in 2027.
SEMI President and CEO Ajit Manocha stated: “The growing demand for semiconductors is increasingly translating into a tangible expansion of manufacturing capacity across the global semiconductor industry. The latest outlook indicates that equipment investment is not only strengthening but also that a significant number of fabs are steadily moving toward operational status. This expansion will provide a robust manufacturing foundation to support artificial intelligence (AI), high-performance computing, and a wide array of next-generation semiconductor applications.”
Global Wafer Fab Construction Projects
Among all 300mm facilities, global fab‑construction spending is projected to grow by 23% in 2026, reaching US$47.5 billion; it will then increase by another 33% in 2027, hitting US$63.3 billion, and further rise to US$68.4 billion in 2028. These construction activities reflect ongoing capacity investments in advanced‑node logic chips, memory devices, and other 300mm semiconductor technologies.
The United States is a key component of this expansion, with additional 300mm fabs and production lines expected to break ground throughout the forecast period. Equipment spending in the Americas is projected to more than double, rising from $18.1 billion in 2026 to $40.6 billion by 2029, underscoring the region’s steadily expanding manufacturing footprint.
SEMI forecasts that 13 new 300mm fabs or production lines worldwide will begin operations or roll out their first wafers by 2026, with this number rising to 23 by 2027.
SEMI’s “300mm Fab Outlook” report, version for the third quarter of 2026, reflects 166 changes across 163 fabs and production lines since the previous edition was released, including 14 newly recorded additions.
Source: SEMI China
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