Wet Cleaning Technology in Semiconductor Manufacturing

Category:

Process Technology

Author:

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Source:

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Release time:

2021-11-09

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Wet cleaning technology in semiconductor manufacturing is a key process link, and its main purpose is to use various inorganic or organic chemical reagents to remove impurities attached to the surface of the chip. These impurities may come from the air, human body, factory buildings, production equipment, chemicals, auxiliary materials, etc., including dust, organic matter, inorganic matter and metal ions. These impurities not only affect the yield and electrical performance of the chip, but also the reliability of the chip. Therefore, cleaning technology plays a vital role in the entire chip manufacturing process.

The working principle of wet cleaning equipment in the semiconductor manufacturing process is based on the principle of chemical reaction and surface affinity. The chemical substances in the cleaning solution react with the impurities or contaminants on the surface of the chip, converting them into soluble compounds, which are then taken away by the cleaning solution, thereby achieving the cleaning of the chip surface. In order to ensure the cleaning effect, the selection of the cleaning solution needs to be determined according to the type of substance to be cleaned and the purpose of cleaning, because different cleaning agents have different chemical properties and can be used to remove specific contaminants.

The impact of wet cleaning technology on chip performance is mainly reflected in the following aspects: first, by removing impure substances that affect the flow of electrons, the electrical performance of the chip is optimized; second, by reducing the formation of lattice defects and grain boundaries, the structural integrity and stability of the chip are improved; finally, the reliability and service life of the chip are improved, and the problems of unstable performance and shortened device life caused by impurities and contaminants are reduced.

As chip manufacturing enters the nano era, the requirements for wafer surface cleanliness are becoming more and more stringent, so cleaning technology has become more complex and indispensable. In the entire chip manufacturing process, cleaning is required before and after the diffusion, deposition, injection and other processes, and each step of cleaning requires different equipment, chemical liquid formulas and process conditions to complete.

In summary, wet cleaning technology in semiconductor manufacturing is a complex and delicate process, which plays a vital role in ensuring the quality and performance of chips. By continuously optimizing cleaning processes and technologies, the development of the semiconductor manufacturing industry can be further promoted.

Pre

The pre-diffusion cleaning process removes organic matter, silica layers, particles and metals, protecting the regenerated oxide!

The processes covered by wet equipment include cleaning, etching, degumming, and scrubbing.

The pre-diffusion cleaning process removes organic matter, silica layers, particles and metals, protecting the regenerated oxide!

The processes covered by wet equipment include cleaning, etching, degumming, and scrubbing.

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