SPM corrosion machine

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SPM corrosion machine

SPM is a commonly used wet chemical solution for photoresist stripping

Process Step
Application area
介绍

- Commodity name: SPM corrosion machine
SPM is a commonly used wet chemical solution for photoresist stripping
- STEP 1: spm slot
- STEP 2: spm QDR slot
- STEP 3: spm slot
- STEP 4: spm QDR slot
Used in wafer manufacturing for cleaning before and after thin-film deposition, before dry etching, after ion implantation, before and after grinding, before and after annealing, before and after polishing, as well as in chemical wet etching cleaning processes.
The SPM automatic cleaning system is primarily used in the LED chip manufacturing process to automatically clean the organic particles and some metallic contaminants from the surface of silicon wafers.

The sulfuric acid and hydrogen peroxide in the SPM solution work together, performing an oxidation-reduction reaction to decompose the photoresist.
- Main functions: The system processes silicon wafers through corrosion, rinsing, and other treatments to achieve the desired results specified by the user.
- It can handle various wafer materials, including silicon, gallium arsenide, indium phosphide, gallium nitride, silicon carbide, lithium niobate, and lithium tantalate.
- The wafer size for cleaning ranges from 2 to 8 inches, with a capacity of 25 wafers per batch.
- Equipment type: Indoor placement
- Operation mode: Fully automated
- Pre-oxidation cleaning
- Residue removal
- Post-photoresist stripping cleaning
- Photoresist stripping and cleaning

The SPM automatic cleaning system is primarily used in the LED chip manufacturing process to automatically clean the organic particles and some metallic contaminants from the surface of silicon wafers.

The sulfuric acid and hydrogen peroxide in the SPM solution work together, performing an oxidation-reduction reaction to decompose the photoresist.

Main functions: The system processes silicon wafers through corrosion, rinsing, and other treatments to achieve the desired results specified by the user.
It can handle various wafer materials, including silicon, gallium arsenide, indium phosphide, gallium nitride, silicon carbide, lithium niobate, and lithium tantalate.
The wafer size for cleaning ranges from 2 to 8 inches, with a capacity of 25 wafers per batch.
Equipment type: Indoor placement
Operation mode: Fully automated
Pre-oxidation cleaning
Residue removal
Post-photoresist stripping cleaning
Photoresist stripping and cleaning

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