KOH Etching

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KOH Etching

KOH etching of silicon wafers depends on the concentration and temperature of the solution

Process Step
Application area
介绍

- Commodity name: KOH Etching
KOH etching of silicon wafers depends on the concentration and temperature of the solution
- Step 1: Sulfuric acid-quartz heating bath
- Step 2: Rinse- QDR quick rinse bath
- Step 3: KOH-heating and filtration bath
- Step 4: Rinse- QDR quick rinse bath
- Step 5: Drying- IPA Vapor Dryer
It is widely used in the fabrication of integrated circuits, advanced packaging, power semiconductors, image sensors, and micro-electromechanical systems (MEMS).
The KOH etching process of silicon wafers is controlled by the concentration and temperature of the KOH solution. KOSEN SEMI’s manual/automatic wet etching equipment precisely controls these two parameters with high accuracy.

Online heater: The chemical liquid temperature can be controlled within ±0.1°C of the set temperature. Real-time monitoring unit: Actively monitors the concentration of the chemical liquid and communicates this information to the workstation’s PLC. If the concentration falls below the set value, chemical agents are added; if the concentration is too high, deionized water is added.

All equipment is designed with a focus on safety, reliability, and productivity.

Our wet etching equipment uses a modular design, facilitating easy maintenance in the future.

SPM corrosion machine

Fully automatic etching machine

SPM corrosion machine

Fully automatic etching machine

The KOH etching process of silicon wafers is controlled by the concentration and temperature of the KOH solution. KOSEN SEMI’s manual/automatic wet etching equipment precisely controls these two parameters with high accuracy.

Online heater: The chemical liquid temperature can be controlled within ±0.1°C of the set temperature. Real-time monitoring unit: Actively monitors the concentration of the chemical liquid and communicates this information to the workstation’s PLC. If the concentration falls below the set value, chemical agents are added; if the concentration is too high, deionized water is added.

All equipment is designed with a focus on safety, reliability, and productivity.

Our wet etching equipment uses a modular design, facilitating easy maintenance in the future.

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