Mega sound wave cleaning

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Mega sound wave cleaning

Mega sound vibration plate, used for assembling slot type mega sound cleaning equipment

  • Product Description
  • Functional Features
  • Application Area
    • Commodity name: Mega sound wave cleaning

    Mega sound vibration plate, used for assembling slot type mega sound cleaning equipment

    • Vibrating plate material: 316L stainless steel, quartz
    • Vibrating plate area: customizable
    • Customizable mega sound cleaning tank
    • Mega sound vibration plate that can be installed directly to the bottom of the cleaning tank, which facilitates secondary development;
    • 1MHz ultra-high frequency ultrasonic wave, more refined sonication effect
    • A uniform sound field, the sound intensity of the vibration plate surface can exceed 5W/cm 2
    • Ultra-low cavitation effect, does not damage the surface of the device
    • Excellent effect on small particles, obvious advantages in high-deep aspect ratio structure cleaning. After precise control of empty six bubbles, megasic sound waves can also be used for cleaning of fine wafer pattern structures.
  • ● Corresponding wafer size: 6-8inch

    Liquid temperature range: 5-80℃

    ● Sensor: PZT

    ● Input power: 600-1200W;

    ● Removed particle diameter: ≤0.2μm

    ● Frequency: (800~1000)kHz;

    ● High-frequency vibration: cavitation effect is stronger and the effect is more delicate

    ● Working principle: Use liquid molecular acceleration to generate energy

    ● Good uniformity: uniform megasonic field, the sound intensity on the vibration plate surface can exceed 5W/cm2;

    ● High-precision cleaning degree: the megasonic emission sound field is evenly distributed, improving the cleaning uniformity;

    ● High corrosion resistance: resistant to various acid and alkali solutions and organic solvents;

    ● Unique transducer bonding technology, higher stability and durability;

    ● Adjustability: parameters such as vibration frequency and power can be adjusted according to different application requirements, which can adapt to the processing requirements of objects of different materials, shapes and pollution levels, improving the versatility and flexibility of the equipment

    • CMP chemical mechanical polishing
    • Pre-bonding cleaning
    • Mask cleaning
    • Development
    • Removal of adhesive
    • Lift-off metal stripping
    • Wet etching
    • Lens cleaning
    • Precision cleaning of display screens and other microelectronics industries

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