Brush (KXW-BF15EN30)

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Brush (KXW-BF15EN30)

PVA Wafer Sponge Brush, Efficiently Removes Contaminants such as Abrasive Residues, Metal Ions, and Organic Matter
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    • Commodity name: Brush (KXW-BF15EN30)

    PVA Wafer Sponge Brush, Efficiently Removes Contaminants such as Abrasive Residues, Metal Ions, and Organic Matter

    The PVA brush is used in the semiconductor CMP cleaning process. It clamps the rotating wafer and leverages its porous structure to store and dispense cleaning fluids. Combined with its rotational motion, elasticity, and hydrophilic properties, the brush effectively flushes or dislodges particles from the wafer surface. This ensures efficient removal of abrasive residues, metal ions, organic contaminants, and other impurities, while simultaneously protecting the wafer's surface and enhancing overall cleaning efficiency.

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