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May 12,2025
The role of silicon wafers in BOE etching process
Buffered oxide etch (BOE) is a commonly used wet etching technique in semiconductor manufacturing, primarily used to remove the oxide layer from the surface of silicon wafers. Silicon wafers, as the core material in the etching process, their properties and behavior directly affect the etching results.
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May 10,2025
How are megahertz waves generated in a wafer cleaning machine?
Wafer cleaning is one of the key processes in semiconductor manufacturing, and its efficiency directly affects chip yield. This article analyzes the classification of wafer cleaning machines and the generation methods of megahertz sound waves, and explores the principles and optimization paths of tank-type, spray-type, and conformal megahertz sound wave technologies, combining the characteristics of immersion and rotary spray cleaning machines. By comparing the acoustic transmission efficiency and application scenarios of different technologies, this article provides a reference for the selection and process optimization of megahertz sound wave cleaning equipment.
May 08,2025
Wuhan Municipal Bureau of Economy and Information Technology actively promotes the integration of resources for the integrated circuit industry fund.
Recently, Li Shitao, Party secretary and director of the Wuhan Municipal Bureau of Economy and Information Technology, emphasized during a field trip investigating the progress of the construction of the Advanced Functional Materials Industry Innovation Joint Laboratory that the government will fully leverage its guiding role, coordinate national strategic funds such as the manufacturing industry transformation and upgrading fund and the integrated circuit industry fund, and help local enterprises strengthen their core technology layout and accelerate the construction of the industrial ecosystem.
May 07,2025
The working principle and importance of wafer cleaning machines
Wafer cleaning machines are crucial equipment in the semiconductor manufacturing industry. Their primary function is to remove contaminants from the wafer surface, ensuring the smooth progress of subsequent processes. This article will delve into the working principles of wafer cleaning machines and their importance in semiconductor production.
May 06,2025
US to impose semiconductor tariffs: rates could reach up to 100%?
May 5, news, the Trump administration may announce details of semiconductor tariffs as early as this week, with market estimates of rates as high as 25% to 100%.
Apr 30,2025
SPM cleaning process
SPM (sulfuric acid/hydrogen peroxide mixture) cleaning process is a common wet chemical cleaning method in semiconductor manufacturing, mainly used to remove organic contaminants (such as photoresist, grease) and inorganic contaminants (such as metal ions) from the surface of silicon wafers. Its core is to achieve efficient cleaning through the synergistic effect of the strong oxidizing properties of sulfuric acid and hydrogen peroxide.
Apr 29,2025
Multiple universities released their "Strengthening Foundation Plan" for 2025, adding cutting-edge areas such as integrated circuits to help solve "stuck neck" problems
Recently, nearly 40 universities, including Tsinghua University, Peking University, University of Electronic Science and Technology of China, and Beihang University, have successively released the recruitment brochures for the 2025 "Strong Foundation Plan", adding several training directions that align with the national strategic emerging industries. The focus is on key areas such as integrated circuits, artificial intelligence, and aerospace, aiming to solve the problem of "stuck necks" in core technologies.
Apr 28,2025
CDS liquid supply system process technology
The Central Chemical Dispense System (CDS), as a core support system, uses automated control to achieve precise dispensing and recovery of chemicals, providing reliable assurance for wet processes in semiconductor manufacturing.
Apr 25,2025
Wafer processing using isopropyl alcohol (IPA) vapor drying
Isopropyl alcohol (IPA) vapor drying technology, due to its unique chemical properties, shows significant advantages in semiconductor wafer drying processes. This article briefly describes the chemical characteristics of IPA and analyzes the principles and operation process of its vapor drying process.
Apr 24,2025
The University of Tokyo has developed a new chip cooling technology that improves efficiency by up to seven times.
A research team from the University of Tokyo has developed a highly efficient cooling solution based on water phase change (boiling).