Forecast and analysis of China's semiconductor equipment development trends in 2023
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Release time:
2023-02-22
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With the continuous advancement of semiconductor technology, the integration of semiconductor devices continues to increase. On the one hand, the chip process nodes are constantly shrinking and are developing in a more advanced direction; on the other hand, the size of the wafer is constantly expanding. In addition, the structure of semiconductor devices is also becoming more complex. By increasing the number of three-dimensional layers, the process problems that are difficult to miniaturize on the plane are solved. These requirements for the precision and stability of semiconductor-specific equipment are getting higher and higher. In the future, semiconductor equipment will develop in the direction of high precision and high integration.
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