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Westlake University successfully developed a 12-inch silicon carbide substrate automated laser lift-off technology
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Industry News
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Release time:
2025-03-31
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On March 27, Westlake University announced that its incubated Westlake Instruments (Hangzhou) Technology Co., Ltd. has successfully developed a 12-inch silicon carbide substrate automated laser lift-off technology, solving the problem of slicing 12-inch and larger ultra-large silicon carbide substrates.
Compared with traditional silicon materials, silicon carbide, with its wider band gap, higher melting point, electron mobility, and thermal conductivity, can operate stably in high-temperature and high-voltage environments, making it a core material for the upgrading of the new energy and semiconductor industries. However, the high cost of silicon carbide substrates has hindered its large-scale application.
“Currently, the high cost of silicon carbide substrate materials seriously hinders the large-scale application of silicon carbide devices.” According to Qiu Min, Chair Professor of the School of Engineering, Westlake University, one of the important ways to reduce costs and increase efficiency in the silicon carbide industry is to manufacture larger silicon carbide substrate materials. Compared with 6-inch and 8-inch substrates, 12-inch silicon carbide substrates increase the area on a single wafer that can be used for chip manufacturing. Under the same production conditions, it can significantly increase chip output and reduce the manufacturing cost per chip.
According to predictions from international authoritative research institutions, the global silicon carbide power device market will reach US$6.7 billion by 2027, with a compound annual growth rate of 33.5%. At the end of last year, domestic companies disclosed the latest generation of 12-inch silicon carbide substrates. The demand for 12-inch and larger ultra-large silicon carbide substrate slices has subsequently emerged.
Previously, Westlake Instruments had pioneered the launch of 8-inch conductive silicon carbide substrate laser lift-off equipment. In response to the latest market needs, Westlake Instruments quickly launched an ultra-large silicon carbide substrate laser lift-off technology, applying ultra-fast laser processing technology to the silicon carbide substrate processing industry, and completed the development of related equipment and integrated systems.
“This technology has automated the processes of silicon carbide ingot thinning, laser processing, and substrate lift-off.” Qiu Min introduced that compared with traditional cutting technology, the laser lift-off process has no material loss, and the raw material loss is significantly reduced.
Qiu Min said that the new technology can significantly shorten the substrate output time, is suitable for the mass production of future ultra-large silicon carbide substrates, and further promotes cost reduction and efficiency improvement in the industry.
Automation,Delamination technology,Automated laser ablation technology,Silicon carbide
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