Design and principle analysis of a high-efficiency chip drying system based on the Marangoni effect

Introduction

In semiconductor manufacturing processes, the drying process after wafer cleaning is crucial to component quality. Traditional drying methods struggle to completely remove deionized water residue, easily forming water spots that degrade device performance. Marangoni effect-based drying technology uses surface tension gradients to drive liquid flow, achieving residue-free drying.

Marangoni Effect Principle

The Marangoni effect is the spontaneous flow of a liquid from a low surface tension area to a high surface tension area due to surface tension differences. In wafer drying, the system sprays low surface tension isopropyl alcohol (IPA) vapor onto the wafer surface, creating a tension gradient with the deionized water (high surface tension), thus driving the water film to quickly detach from the wafer surface. This process requires no mechanical contact, avoiding wafer damage and significantly improving drying efficiency.

System Structure and Workflow

1. System Composition

Housing and Liquid Tank

Housing: Contains deionized water and houses the wafer to be dried.

Liquid Tank: Stores isopropyl alcohol (IPA) and is equipped with a bubble generator to continuously produce IPA vapor.

2. Diffuser Array

The system is configured with three sets of diffusers: the first diffuser is located at the top of the housing, and the second and third diffusers are located on both sides of the housing.

The diffusers deliver IPA vapor via inert nitrogen (N₂) for uniform spraying onto the wafer surface.

3. Guiding and Separation Mechanism

Guide grooves are provided on both sides of the housing to ensure stable wafer lifting and lowering; a separation groove and injection holes are designed at the bottom of the cover for wafer positioning and vapor guidance.

4. Drying Process

After deionized water cleaning, the wafer is slowly lifted by the lifting mechanism.

IPA vapor is uniformly sprayed onto the wafer surface through the diffuser, forming a surface tension gradient that drives the water film to detach.

After drying, the wafer detaches from the housing through the separation groove and enters the next process.

Technical Advantages

Highly Efficient and Residue-Free: The Marangoni effect combined with IPA vapor injection thoroughly removes water films, preventing water spots.

Non-Contact Drying: Reduces mechanical friction, protecting the integrity of the wafer surface.

Optimized Energy Consumption: Nitrogen recycling and vapor recovery design reduce isopropyl alcohol consumption.

Conclusion

The Marangoni-type drying system described in this article uses surface tension gradients to drive drying, solving the problem of water spot residue in traditional processes. Its modular design and high efficiency provide reliable technical support for semiconductor manufacturing. Future optimization of diffuser layout and vapor distribution parameters can enable wider industrial applications.

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