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SC-2 Cleaning Solution Composition
Category:
Process Technology
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Release time:
2025-07-30
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SC-2 Cleaning Solution
Application Areas: Semiconductor Manufacturing (RCA Standard Cleaning Process)
Core Function: Removes metallic contaminants and organic residues from the wafer surface
I. Core Components and Functions
| Components |
Typical Concentration |
Core Function |
| Hydrochloric Acid (HCl) |
6%~10% |
Reacts with metal ions (Al³⁺, Fe²⁺/³⁺, Cu²⁺, etc.) to form soluble chlorides; slightly assists in dissolving oxides. |
| Hydrogen Peroxide (H₂O₂) |
5%~15% |
Strongly oxidizes and decomposes organic matter (photoresist, grease → CO₂ + H₂O); enhances HCl's ability to oxidize and dissolve metals. |
| Deionized Water (DI Water) |
Remaining |
Dilutes reactants, controls reaction rate, and prevents excessive wafer corrosion. |
II. Standard Formula (Volume Ratio)
Concentrated Hydrochloric Acid (37%): 1 part
Hydrogen Peroxide (30%): 1~3 parts
Deionized Water: Add to total volume (Example: 1 part HCl + 1 part H₂O₂ + 98 parts DI Water)
Note: The actual ratio needs to be adjusted according to process requirements; the total system is supplemented with DI Water.
III. Cleaning Mechanism
1. Metal Removal
HCl → Dissolves metal ions to form soluble salts (such as AlCl₃, FeCl₃); H₂O₂ → Oxidizes low-valent metals to enhance solubility.
2. Organic Matter Decomposition
H₂O₂ → Oxidatively degrades organic matter into CO₂ and H₂O; HCl → Assists in dissolving polar organic matter.
3. Surface Passivation
After cleaning, a hydrophilic Si-O bond micro-oxidation layer is formed on the wafer surface, inhibiting secondary adsorption.
IV. Process Parameters
| Parameter |
Range |
Description |
| Temperature |
Room Temperature ~ 80℃ |
High temperature accelerates the reaction (>80℃ may damage the wafer) |
| Time |
5~20 minutes |
Dynamically adjust according to the degree of contamination |
| Method |
Immersion/Spray |
Can be combined with Ultrasonic/Megahertz sound waves Enhanced effect |
V. Key Precautions
1. Equipment Corrosion Resistance
→ Requires PFA/PTFE material tank (Avoid stainless steel corrosion).
2. Waste Liquid Treatment
→ Must Neutralize (e.g., add NaOH to neutral pH) before discharge.
3. Safety Protection
→ Operators must wear: acid-resistant gloves + goggles + splash-proof clothing + fume hood.
4. Storage Requirements
→ Prepare and use immediately (H₂O₂ easily decomposes); store in a sealed container away from light.
VI. Application Summary
SC-2, with its acidic dissolution of HCl and strong oxidation of H₂O₂ synergistic effects, efficiently removes metal/organic contamination from the wafer surface and is one of the core processes in semiconductor wet cleaning. Its simple formula and controllable cost make it widely used in 8/12-inch wafer manufacturing and advanced packaging fields.
Kexin Micro Company - Leading the Innovation of Semiconductor Cleaning Technology
For more technical details, please contact our technical consultant: 13861996325!
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SC-2,Cleaning solution
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