Boshi Microelectronics packaging project put into production, monthly production capacity will exceed 200 million pieces!

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Industry News

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2025-08-05

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According to Binhai Release, on August 1st, Boxin Microelectronics (Tianjin) Co., Ltd. (hereinafter referred to as "Boxin Microelectronics") officially commenced production at the Microelectronics Innovation Industrial Park in Tianjin Economic Development Area. This news is like a pebble dropped into the lake of the semiconductor industry, causing ripples.

The commencement of production by Boxin Microelectronics is of great significance. After reaching full production capacity, the monthly chip packaging capacity is expected to exceed 200 million units, and the annual revenue is expected to reach over 200 million yuan. Such impressive production capacity and revenue expectations undoubtedly inject a strong stimulant into the industry's development.

In terms of business layout, Boxin Microelectronics currently focuses on two major packaging types: DFN (dual flat no-lead package) and QFN (quad flat no-lead package), with its packaging products mainly focusing on power protection chips. These two packaging forms are widely used in the market and have advantages such as small size and stable performance, meeting the needs of numerous electronic devices for chip packaging.

It is worth mentioning that Boxin Microelectronics is not content with the status quo and has a clear and ambitious development plan. In addition to increasing the production capacity of existing products, the company will also actively expand its business scope, adding Flip chip advanced packaging sample lines, and developing power SiC (silicon carbide), GaN (gallium nitride) chip packaging fields, while also entering the RF radio frequency module and audio power amplifier IC module product lines. This means that Boxin Microelectronics will gradually transition from miniaturization packaging to advanced packaging, achieving technological upgrades and product diversification.

Boxin Microelectronics was established in 2022 and registered by the Institute of Microelectronics, Chinese Academy of Sciences. With the strong scientific research support of the Institute of Microelectronics, Chinese Academy of Sciences, Boxin Microelectronics has unique advantages in technology research and development and talent cultivation. It is believed that in the future, Boxin Microelectronics will, with its own technological strength and innovative spirit, carve out its own place in the field of semiconductor integrated circuit packaging and testing.

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Trump will impose a 100% tariff on chips

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