Fully Automatic RCA Cleaning System: Core Technology and Innovative Value in Semiconductor Manufacturing Cleanroom Processes

I. Technical Principles and Cleaning Process

The fully automatic RCA cleaner is based on the classic RCA standard cleaning method, integrating chemical wet processing with physical cleaning mechanisms. It effectively removes organic contaminants and particles using SC-1 (an ammonia-hydrogen peroxide mixture), while SC-2 (a hydrochloric acid-hydrogen peroxide blend) specifically targets and dissolves metallic impurities. Combined with the cavitation effect of megasonic waves, this system ensures the removal of nanoscale particles without compromising the delicate microstructures of wafers. The equipment also supports precise control over key process parameters, such as chemical solution concentration, temperature, duration, and megasonic frequency (ranging from 20 to 100 kHz), making it well-suited for the cleaning needs of advanced semiconductor device architectures—including FinFET and GAA designs.

II. System Composition and Functional Features

The equipment features a multi-chamber modular architecture, enabling parallel processing of various cleaning tasks such as de-gluing, etching, rinsing, and drying, thereby significantly boosting production line efficiency. The system integrates high-precision sensors with a PLC control unit to continuously monitor and adjust parameters like flow rate, temperature, and rotational speed in real time. Additionally, it seamlessly connects with the MES system via the SECS/GEM protocol, facilitating process data traceability and remote maintenance operations. Furthermore, the equipment is equipped with a built-in ion fan that effectively eliminates static electricity, reducing particle adhesion during the process.

III. Performance Metrics and Cleaning Effectiveness

This equipment excels in pollutant control, effectively removing more than 99% of particles measuring 25 nanometers or larger. It also keeps metal contamination below 5 × 10⁹ atoms per square centimeter, meeting the stringent cleanliness requirements for substrates used in advanced processes like EUV lithography. Moreover, its gentle, low-damage characteristics ensure the integrity of delicate microstructures during cleaning, while seamlessly supporting flexible switching between acidic and alkaline cleaning solutions and offering customizable drying options—demonstrating exceptional process adaptability and tailored capabilities.

IV. Application Scope and Industry Value

The fully automatic RCA cleaning machine is widely used in front-end semiconductor processes (such as pre-film cleaning, post-CMP cleaning, and gate oxide pretreatment) as well as in back-end processes (including post-etch cleaning and back-side thinning pre-treatment). In addition to single-crystal silicon, it is also compatible with a variety of materials, including polycrystalline silicon, silicon nitride, and metal films. As a core piece of equipment in semiconductor manufacturing lines, this machine delivers exceptional cleanliness, superior stability, and eco-friendly features—critical factors that help enhance chip yield and drive process advancements, while simultaneously accelerating the localization of semiconductor equipment production.

V. Environmental Protection and Sustainable Development

The new-generation equipment integrates a waste liquid classification and recycling system, achieving a chemical recovery rate exceeding 99% for substances like hydrofluoric acid and hydrogen peroxide—significantly reducing both waste liquid emissions and raw material consumption. Meanwhile, by optimizing the structure of water and electricity resource usage, purified water consumption is maintained below 1 liter per minute, while drying energy consumption is reduced by 30% compared to conventional methods, aligning seamlessly with green manufacturing practices and global environmental standards.

Kexinwei Company – Leading the Innovation in Semiconductor Cleaning Technology

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