The Guardian Role of Fully Automatic RCA Cleaners in Semiconductor Manufacturing

I. Overview of the Equipment and Its Core Positioning

In the highly sophisticated semiconductor manufacturing industry, cleanliness is one of the core factors determining chip performance and yield. Fully Automatic RCA Cleaning Machine As a critical piece of equipment for wafer surface treatment, it not only plays an essential role in removing contaminants but also serves as an indispensable "cleaning guardian" in modern integrated circuit manufacturing processes. Widely used in front-end processes—such as pre-gate oxide cleaning and post-CMP cleaning—as well as in back-end applications like pre-packaging pretreatment, this equipment significantly enhances chip yield while helping to reduce defect rates.

II. Core Technology Features

1. Standardized Cleaning Process

The equipment strictly follows standard procedures such as SC-1 (organic removal) and SC-2 (metal residue removal), allowing for flexible control of chemical concentrations, temperature, and processing time. The cleaning process is fully automated, encompassing pre-cleaning (DIW rinsing), main cleaning (chemical spraying + megasonic enhancement), and drying stages (centrifugal spin-drying + purging).

2. High-efficiency pollutant removal capability

Particle Removal: The cavitation effect of megasonic waves can eliminate more than 99% of ultrafine particles (≥25 nm), preventing damage to microstructures.

Metal Control: For metal contaminants such as Al, Cu, and Fe, the contamination density can be reduced to below 1 × 10¹⁰ atoms/cm².

Organic decomposition: The SC-1 step effectively removes photoresist and additive residues, preventing process adhesion.

3. Intelligent and Modular Design

Multi-chamber configuration (4–8 chambers) supports parallel processing of different processes, enhancing production capacity.

The PLC system monitors process parameters in real time and supports SECS/GEM protocol integration with the MES system.

Integrated ionizing air blower effectively controls static electricity and reduces particle adhesion.

4. Environmental Protection and Energy-Saving Features

The classified recycling rate of waste liquids exceeds 99%, significantly reducing the consumption of hazardous chemicals such as HF and H₂O₂.

Pure water consumption is less than 1 L/min, and the drying process energy consumption is reduced by 30% compared to traditional methods.

III. Main Application Scenarios

1. Pre-Process Cleaning

Substrate cleaning before film formation (PVD/CVD pretreatment);

Residue Removal After CMP;

Nanometer-level cleanliness assurance before gate oxidation.

2. Post-processing techniques

Post-etching via-hole/trench cleaning;

Pre-treatment of the front surface before back-side thinning;

Compatible with a variety of materials, including polysilicon, silicon nitride, and metal films.

IV. Summary of Key Advantages

High Cleanliness : Particle residue < 0.1 particle/cm², metal contamination < 5 × 10⁹ atoms/cm², meeting the requirements of advanced processes such as EUV;

Low damage rate : The ultrasonic frequency is adjustable (20–100 kHz), preventing damage to delicate structures such as FinFETs/GAAFETs;

High Customization : Supports switching between acid and alkaline formulations, cavity expansion, and optional drying modes (such as IPA dehydration);

Domesticization Progress : The core components are independently controllable and compatible with the AMHS material handling system, having been successfully verified across multiple mainstream domestic production lines.

V. Conclusion

Although the fully automatic RCA cleaning machine plays a supporting role, it is a critical piece of foundational equipment that ensures chip yield and drives the continuous miniaturization of manufacturing processes. With its high precision, exceptional stability, and eco-friendly design, it safeguards the cleanliness of every single wafer, thereby safeguarding the advancement and growth of the semiconductor industry. As we move toward ever-more advanced process nodes and increasingly complex integration technologies, the technological innovation and domestic substitution of such equipment will continue to hold profound strategic significance.

Kexinwei Company – Leading the Innovation in Semiconductor Cleaning Technology

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