The Technology and Structure of Fully Automatic RCA Cleaning Machines

I. Overview of the RCA Cleaning Process

The RCA cleaning method is a classic wet-process technique for semiconductor wafer cleaning, widely used to remove organic contaminants, metal ions, and particles. This method involves alternating treatments with a series of chemical solutions (such as SC-1 and SC-2) and ultrapure water, combined with physical actions like ultrasonic agitation, scrubbing, and spraying, to achieve highly effective cleaning of the wafer surface.

Although the traditional RCA process has a long history, as semiconductor process nodes continue to shrink, its process details have been steadily optimized, and its level of automation has significantly improved—leading to the development of fully automated RCA cleaning machines.

II. Main Features of the Equipment

• Automation Control: Utilizing a PLC (Programmable Logic Controller) for fully automated control, the system supports the storage and recall of multiple process recipes, seamlessly adapting to diverse production requirements.
• Flexible operation modes: Equipped with both manual and automatic operation modes, making it easy for equipment debugging and emergency handling.
• High-precision transmission system: Front-mounted robotic arm transmission, equipped with dual mechanical and electrical limit protection features, ensuring accurate positioning and smooth, reliable operation.
• Material diversity: The equipment body and槽体 can be made from corrosion-resistant materials such as PVC, PP, and SUS304, depending on the properties of the chemical solution.
• Modular Process Design: Supports the flexible configuration of various process modules, including spray, overflow, circulation, agitation, rotation, cooling, and ultrasonic applications.
• Visual operation: The device's door panel features a transparent window, making it easy to observe the internal operating status in real time.
• Integrated functionality: Features a built-in, customized spin-drying module that can be operated with a single click via the main control interface, enhancing process consistency.

III. Detailed Explanation of Cleaning Process Methods

IV. Equipment Structure and Composition

The fully automatic RCA cleaning machine is primarily composed of the following system modules:

1. Mechanical Structure System

• Rack: Constructed by welding SUS304 stainless steel square tubes together, ensuring a sturdy and stable structure.
• Housing material: Select PVC, PP, or SUS304 sheet based on the corrosiveness of the liquid medicine.
• Process tank body: Materials include high-purity, corrosion-resistant options such as quartz, PTFE, PVDF, and SUS316.

2. Transmission and Execution System

• Mechanical arm: Equipped with resistance to acids, alkalis, and organic solvents, making it suitable for harsh process environments.
• Transmission mechanism: Servo motor-driven, featuring high precision and fast response.

3. Control System

• Electrical control cabinet: Located at the upper rear of the equipment, it is completely isolated from the process area to ensure electrical safety.
• Human-machine interface: Touchscreen operation, supporting features such as recipe management, status monitoring, and fault alarms.

4. Auxiliary Systems

• The exhaust system consists of a damper, air duct, and adjustable louvers, effectively removing harmful gases and vapors.
• Water and gas systems: Providing ultra-pure water, nitrogen, compressed air, and other process media.
• Spin-drying module: Integrated inside the equipment to quickly dry wafers after cleaning.

V. Conclusion

The fully automatic RCA cleaning machine builds upon the traditional RCA process, featuring a highly integrated, modular, and intelligent design that significantly enhances cleaning efficiency and process consistency. As semiconductor manufacturing processes continue to advance toward smaller nodes, RCA equipment will further evolve technologically in areas such as materials, control systems, and energy efficiency—driven by the need to meet the stringent cleaning requirements of next-generation, high-end fabrication techniques.

Kexinwei Company – Leading the Innovation in Semiconductor Cleaning Technology

For more technical details, please consult our technical advisor: 13861996325!

▲ Technical Consulting ▲ Follow Kexinwei's WeChat Official Account