Common Classification of Wet-Process Equipment for Semiconductors

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Process Technology

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Release time:

2025-09-24

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Semiconductor wet-process equipment refers to the machinery used in semiconductor manufacturing processes that involve liquid chemical reagents for tasks such as cleaning, etching, and deposition. Below is a classification and description of commonly used models:

1. Clean the equipment

Function : Used to remove contaminants and impurities from semiconductor surfaces, enhancing the electrical performance and stability of devices.
Craft Characteristics Combining chemical and physical actions, it possesses highly selective etching capabilities, effectively removing ultra-fine particles and residues without compromising the delicate structures on the wafer surface.

II. Pickling Equipment

Function : Primarily used to remove oxides, organic contaminants, and metallic impurities from semiconductor surfaces.
Common Reagents : Acidic solutions such as hydrochloric acid and sulfuric acid.
Principles of the Craft : Cleaning is achieved by allowing an acidic solution to chemically react with surface contaminants.

3. Alkali Washing Equipment

Function : Used to remove organic substances and metallic impurities from surfaces.
Common Reagents : Alkaline solutions such as sodium hydroxide and ammonium hydroxide.
Principles of the Craft : Utilizing an alkaline solution to chemically react with pollutants, thereby achieving the cleaning objective.

IV. Corrosive Equipment

Function : Controlling the corrosion of semiconductor material surfaces is commonly used in patterning processes.
Commonly Used Corrosive Solutions : Hydrofluoric acid, ammonia solution, hydrogen peroxide, and more.
Craftsmanship Advantages : Wet etching does not damage the substrate and offers complete etching capability, making it suitable for manufacturing complex devices.
Key parameters : Corrosion rate, uniformity, cross-contamination control, and cleaning efficiency.

V. Deposition Equipment

Function : Depositing thin-film materials onto the semiconductor surface.
Common methods ：

Chemical Vapor Deposition (CVD)

Physical Vapor Deposition (PVD)

Electrochemical Deposition (ECD)

Manufacturing Process : By introducing reaction gases into the reaction chamber, the desired thin film is formed on the wafer surface.

Summary

With the advancement of semiconductor technology, wet-process equipment continues to evolve, with new models constantly emerging to meet the demands of advanced materials and innovative processes. The five types of equipment mentioned above are currently the core machines used in semiconductor wet-processing techniques, each playing an indispensable role in critical steps such as cleaning, etching, and deposition.

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Wet-process equipment,Cleaning equipment,Pickling Equipment,Corroding equipment,Semiconductor Manufacturing

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