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Targeting the advanced packaging market, Intel is partnering with Amkor Korea to deploy EMIB production capacity.
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Industry News
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Release time:
2025-12-03
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According to recent reports from South Korean media, Intel has established a production line for its advanced packaging technology “EMIB” within Amkor’s K5 factory in Songdo, South Korea.
EMIB is a 2.5D packaging technology used to interconnect different semiconductor dies. In AI chips, this technology enables high-bandwidth memory (HBM) to be arranged around the graphics processing unit (GPU). Signals are transmitted via a silicon bridge embedded in the semiconductor substrate, known as "EMIB." Compared to the silicon interposer typically used by competitors, EMIB offers advantages in cost-effectiveness and production efficiency. Thanks to the use of silicon bridges, EMIB is considered superior in terms of both price and manufacturability, while also enabling precise 2.5D packaging.
Intel has planned to begin mass production of its next-generation EMIB technology—EMIB-T—in 2026. EMIB-T is an advanced technology that incorporates silicon through-silicon vias (TSVs) into the silicon bridge. TSVs provide vertical signal transmission paths, significantly boosting the speed and overall performance of the final products. Given that Intel has already established a comprehensive EMIB partnership with Amkor Technology, industry insiders generally expect that the two companies will likely continue their partnership on EMIB-T technology and further expand the scope of their collaboration.
Industry insiders point out that Intel has previously carried out EMIB packaging for high-performance semiconductors exclusively at its own facilities in locations such as the United States and Malaysia. This shift toward outsourcing its technology is primarily aimed at meeting growing market demand and thereby expanding its global supply chain. It is reported that Intel and Amkor signed an EMIB technology partnership agreement as early as April 2025, and ultimately selected Songdo K5 as the facility to actually drive forward this collaboration.
Currently, Amkor Technology has packaging facilities worldwide, including in the United States, South Korea, and Singapore. Among these, the K5 facility in Songdo, South Korea, is equipped with highly advanced machinery, enabling it to package semiconductors for major technology companies in North America—this is precisely why Intel chose this particular facility.
Moreover, Songdo’s excellence in the infrastructure required for packaging—covering materials, components, equipment, and human resources—was also a key factor in Intel’s decision-making process. Industry experts believe that this collaboration is expected not only to bring economic and industrial benefits to the Songdo region but also to enhance South Korea’s strategic position in the global semiconductor supply chain.
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