Technical Advantages of Fully Automatic Wet Etching and Cleaning Machines

1. Fully Automatic Wet Etching and Cleaning Machine

The fully automatic wet etching and cleaning machine is an automated system specifically designed for surface treatment and cleaning of semiconductor wafers, electronic components, and microstructured devices. Utilizing programmable chemical etching and multi-stage cleaning processes, this equipment effectively removes surface particles, metallic impurities, oxides, and organic residues, and can also perform micropattern etching within the same process. Compared to conventional cleaning methods, this equipment achieves full-process automation—from loading, etching, cleaning, rinsing, drying, to inspection—significantly enhancing process consistency, repeatability, and production capacity.

The main application areas include:

• Front-end and Mid-end Cleaning and Surface Modification of Semiconductor Wafers
• Micro- and Nano-Structuring Etching and Cleaning for LEDs, Mini/Micro LEDs, and Optoelectronic Devices
• Precision Surface Processing of MEMS Sensors and Actuators
• Cleaning and Residue Removal in High-Density Packaging (such as Fan-Out and 3D IC)
• Surface Treatment for High-Frequency PCBs, Ceramic Substrates, and Special Electronic Components

The equipment supports substrates of various sizes and materials, and features excellent line compatibility and process flexibility.

II. Operating Principle of the Equipment

The fully automatic wet etching and cleaning machine is based on chemical etching and fluid dynamics control. Its typical process flow is as follows:

Intelligent Feeding and Positioning

• The substrates are automatically transferred using a robotic arm or FOUP/FOSB interface, while a vision system performs precise positioning and pose correction.

Precision wet etching

• The etching solution—whether acidic, alkaline, or a specialized etchant—is automatically formulated according to the process recipe. By synergistically controlling multiple parameters—including temperature, flow rate, spray pressure, and duration—the system achieves uniform and controllable etching results.

Multi-level collaborative cleaning and rinsing

• After etching, the wafers proceed to a multi-tank or single-tank multi-step cleaning unit, where technologies such as ultrapure water, megasonic cleaning, or carbon dioxide snow cleaning are employed to gradually remove chemical residues and prevent cross-contamination.

High-efficiency drying treatment

• By combining multiple methods such as centrifugal drying, IPA vapor drying, infrared radiation, and air knife blowing, we achieve a drying effect that is residue-free and minimizes stress.

Online Detection and Intelligent Sorting

• Integrates optical detection, particle counting, or surface energy spectroscopy modules to monitor the quality of cleaning and etching in real time and automatically sort qualified and unqualified products.

The entire process is scheduled by the MES/ERP system, enabling traceability of process parameters and closed-loop control.

III. Technological Advantages

Nanoscale Cleanliness and Precision Etching Capability

By leveraging chemical synergy and physical-assisted cleaning technologies, nanoscale particles and sub-nanometer film residues can be effectively removed, with etching uniformity reaching within ±3%.

Fully automatic and intelligent operation

Supports recipe management, adaptive process adjustments, self-diagnosis of faults, and remote monitoring, reducing manual intervention and improving overall equipment effectiveness (OEE).

High process stability and consistency

All critical parameters—concentration, temperature, time, and flow rate—are digitally controlled in a closed-loop system, ensuring high consistency from batch to batch.

Compatible with multiple materials and sizes.

It is compatible with wafers ranging from 2 inches to 12 inches, as well as irregular-shaped devices and panel-level packaging substrates, and supports rapid tool changes and mixed-mode production.

Green Manufacturing and Resource Conservation

Equipped with a chemical liquid circulation and regeneration system, water-saving spray design, and integrated treatment of exhaust gases and waste liquids, it meets the requirements of sustainable manufacturing.

Full-process data traceability

Real-time collection and storage of process data, inspection results, and equipment status, supporting quality traceability, process optimization, and predictive maintenance.

IV. Key Points for Operation and Maintenance

• Chemical Liquid Management: Real-time monitoring of the activity of etching and cleaning solutions, and establishment of an automatic replenishment and waste liquid collection system.
• Water and gas system maintenance: Regularly service ultrapure water systems, gas filtration units, and drying modules to ensure medium purity.
• Maintenance of Mechanical and Sensing Components: Perform preventive maintenance and calibration on robotic arms, pumps, valves, nozzles, and optical sensors.
• Software and Process Updates: Continuously optimize process formulations based on product iterations, and update equipment control and data analysis algorithms.
• Safety and Environmental Compliance: Strictly enforce chemical handling procedures and equip with leak detection and emergency response systems.

Kexinwei Company—Pioneering Innovation in Semiconductor Cleaning Technology

For more technical details, please consult our technical advisor at: 13861996325!

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