TSMC’s “Japan Second Fab” Confirmed for Upgrade: Mass Production of 3-Nanometer Chips in 2028!

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Industry News

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2026-04-02

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According to reports, TSMC, the world’s largest chip foundry, plans to begin mass production of advanced 3-nanometer (3nm) chips in Japan in 2028.

TSMC is the preferred chip manufacturer for companies such as NVIDIA, AMD, and Broadcom. According to TSMC’s filings, its second fab in Kumamoto is slated to use the 3-nanometer process and have a monthly capacity of 15,000 12-inch wafers.

As background, TSMC established a subsidiary in Japan, Japan Advanced Semiconductor Manufacturing (JASM), in 2021. Initially, the venture received support from Sony Semiconductor Solutions Corporation; subsequently, DENSO and Toyota Motor Corporation joined as minority shareholders.

Notably, TSMC’s first fab in Japan commenced mass production at the end of 2024, with progress going smoothly. According to the aforementioned plan, the second fab is scheduled to begin operations in 2028.

This will mark Japan’s first domestic production capability for 3-nanometer process technology. 3-nanometer chips are among the most advanced semiconductor technologies in the fields of artificial intelligence (AI), high-performance computing, and next-generation electronic products.

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