With a total investment of RMB 2 billion, the Fulede Yangtze River 12-inch wafer recycling project has officially broken ground in Hefei Xinzhuan High-tech Industrial Development Zone.

At 11:00 a.m. on April 23, 2026, the groundbreaking ceremony for the 12-inch semiconductor wafer refurbishment project of Fulede Changjiang (Hefei) Semiconductor Materials Co., Ltd. was officially held in the Hefei New Station High-tech Industrial Development Zone, marking the launch of another major project in China’s wafer refurbishment sector. This initiative will inject new momentum into the high-quality development of Hefei’s integrated circuit industry and provide strong support for achieving independent and controllable operations across China’s semiconductor supply chain.

Lu Qinsan, Secretary of the Party Working Committee and Director of the Management Committee of Hefei Xinzhuan District; He Xianhan, Chairman of the Board of Ferrotec Group (China); Guo Zhaozhi, Deputy General Manager of Hefei Construction Investment Holding (Group) Co., Ltd.; Gu Xuelong, General Manager of Fulide Changjiang (Hefei) Semiconductor Materials Co., Ltd.; and other leaders attended the ceremony and delivered remarks. The ceremony was hosted by Cheng Xiangyang, Deputy General Manager of Shanghai Shenhua Investment Co., Ltd. Nearly 150 people—including heads of various functional departments and community organizations in Hefei Xinzhuan District, representatives of resident enterprises and related institutions, representatives of financial institutions, staff from the project’s construction, design, and supervision firms, and employee representatives from Fulide Changjiang Semiconductor—gathered on site to jointly witness this significant moment.

According to reports, this project represents Fulede Yangtze Semiconductor’s key strategic investment in Hefei Xinzhuan High-tech Industrial Development Zone. The site is located on the southwest corner of the intersection of Dayu Middle Road and Meichonghu Road in the zone, with a planned land area of approximately 132 mu. Total investment for the project amounts to RMB 2 billion, to be implemented in two phases, with Phase I accounting for about RMB 1 billion. Under the plan, once Phase I reaches full production capacity, it will achieve a monthly regenerative processing capacity of roughly 300,000 12-inch wafers, generating annual revenue of approximately RMB 400 million. Upon full completion of the project, monthly capacity is expected to increase to 700,000 wafers, with total annual revenue potentially exceeding RMB 800 million, thereby further expanding the scale of China’s large-diameter wafer regeneration industry.

The launch of this project also marks a new phase in the Ferrotec Group’s 12-inch wafer refurbishment initiative, building on the Tongling plant’s existing capacity of 300,000 wafers per year to accelerate capacity expansion, enhance quality and efficiency, and drive iterative upgrades. This development is of great significance for refining the Group’s semiconductor industry-chain footprint and strengthening its competitive edge in the sector.

As a leading enterprise in China’s wafer refurbishment sector, Fulede Changjiang Semiconductor was established in September 2019 and serves as a key component of Ferrotec (China)’s global strategic deployment in the semiconductor industry. Leveraging the technological expertise of its shareholders and supported by state capital, the company has built a comprehensive wafer refurbishment process system and has been recognized as a national-level high-tech enterprise and a provincial-level specialized, refined, distinctive, and innovative SME. The company has long focused on independent R&D of core technologies and has continuously tackled challenges in the 12-inch wafer refurbishment field. By employing proprietary wet stripping and grinding–polishing processes, it has successfully broken the longstanding technology monopoly held by Japanese and South Korean firms. Its process capabilities now extend to cutting-edge process nodes of 19 nanometers and below, and it holds numerous invention patents in critical areas such as wafer defect detection, scratch repair, and precision cleaning. These achievements provide a reliable domestically developed solution for high-precision refurbishment of large-diameter wafers, making the company a crucial link in safeguarding the security of China’s supply chain for advanced logic and memory chip manufacturing.

The establishment of this project in Hefei Xinzhuan High-tech Industrial Development Zone represents a significant step toward synergistic industrial development between the enterprise and the local economy. Currently, the zone has attracted 65 upstream and downstream companies in the integrated circuit industry, forming a complete value chain that spans design, manufacturing, and packaging and testing. It is home to industry leaders such as JCET Group and ChangXin Memory Technologies, with JCET Group serving as the “chain leader” in 12-inch wafer foundry services and steadily increasing its monthly production capacity, and ChangXin Memory Technologies as the domestic frontrunner in DRAM memory chips. Upon commissioning, the project will provide localized support for the advanced-process needs of these regional supply-chain firms, significantly reducing logistics lead times and circulation costs in the wafer reprocessing stage for downstream customers. Moreover, it will enhance the supply resilience and production responsiveness of the broader semiconductor cluster in the face of external market volatility, further strengthening the regional integrated-circuit value-chain ecosystem and amplifying the cluster effect.

Hefei Xinzhuan High-tech Industrial Development Zone is vigorously implementing the “2411” modern industrial system construction plan, continuously strengthening its leading “chip-and-display” industries, and making all-out efforts to build a world-class “chip-and-display” industrial cluster with international competitiveness. Looking ahead, Fulede Changjiang Semiconductor will take the Hefei project as an opportunity to accelerate project construction, strive for early commissioning and tangible results, continually increase R&D investment, expand coverage of advanced process nodes, deepen collaboration with upstream and downstream enterprises in the industrial chain, promote technological innovation and industrial upgrading, actively integrate into the industrial development layout of the Xinzhuan High-tech Zone, and jointly foster a new, secure, efficient, and sustainable semiconductor industry ecosystem. In doing so, the company will contribute to China’s goal of achieving independent and controllable development of the semiconductor industry and inject new momentum into Hefei’s efforts to establish itself as a landmark hub for the “chip–display–automotive” industry.