Total Investment of RMB 1 Billion! Construction Begins on the Zhongxinlian Advanced Semiconductor Materials and Core Components Manufacturing Base
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Industry News
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Release time:
2026-04-30
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On the morning of April 29, a groundbreaking ceremony was held for the Advanced Materials and Core Components Manufacturing Base Project for the Pan-Semiconductor Industry at Suzhou Zhongxinlian Electronic Materials Co., Ltd.
Suzhou Zhongxinlian Electronic Materials Co., Ltd. was established in February 2020. The company focuses on the manufacturing of semiconductor chips using process nodes below 14 nanometers, with a particular emphasis on the R&D and production of advanced ceramic materials for plasma etching equipment. Its core product portfolio centers on yttria-based ceramics, including high-purity yttria ceramic structural components and yttria–alumina composite YAG ceramic structural components. In addition, the company offers yttria-based and dense-coating thermal-spray services for various substrate components used in plasma etching equipment. Its products currently hold the largest market share in the electrostatic chuck segment for LCD panel etching processes, and its semiconductor-grade electrostatic chucks have successfully overcome key technological barriers and entered mass production, thereby resolving the “bottleneck” issue in this field.
The semiconductor advanced materials and core-component manufacturing base project, which has now commenced construction, represents a total investment of RMB 1 billion. Upon completion and full production, the facility is expected to produce 104,000 ceramic structural components and 26,000 thermal-spray processed parts annually, with key product categories including electrostatic chucks and advanced ceramics for etching equipment—both critical structural components. At the same time, the company will leverage this opportunity to further expand production capacity, optimize its product mix, and strengthen its core competitiveness, thereby elevating China’s level of domestic production of core materials for the broader semiconductor industry to a new height.
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