Shilan Jihua’s 12-inch analog chip project is racing toward topping out by year-end.
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Industry News
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Release time:
2026-09-09
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Recently, the Xiamen Silan Jihua 12-inch high-end analog integrated circuit project has made new progress: the basement and raft foundation works have been fully completed, and the main plant building on the southern plot as well as the superstructure of the power and ancillary facilities on the northern plot have entered the construction phase. Zhu Lirong, chief commander of the Xiamen Silan Project Command, disclosed key construction milestones, noting that the project is scheduled to achieve full roof capping by the end of December 2026, with the plant buildings expected to be handed over in May 2027 and commercial production commencing in September 2027. Compared with the original plan to bring the line online in the fourth quarter of 2027, the overall construction schedule has been advanced.
This project is a key industrial initiative in Fujian Province, with a total investment of RMB 20 billion. It will build a 12-inch advanced analog‑chip production line and operate under an IDM model. The project will be implemented in two phases: Phase I is planned to achieve a monthly capacity of 20,000 wafers, while Phase II will add an additional 25,000 wafers per month. Silan Micro has already established multiple chip‑manufacturing facilities in Haicang, Xiamen, where more than 70 upstream and downstream semiconductor suppliers have clustered around the company, forming a regional semiconductor industry cluster. The progress of the subsequent topping‑out, equipment installation, and commissioning of the Silan Jihua project remains subject to further public disclosure by the company and the construction contractor.
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