India Approves Four Semiconductor Projects, Including First Compound Semiconductor Wafer Fab

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2025-08-18

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Indian officials recently announced the approval of 4 new semiconductor projects under the Indian Semiconductor Mission (ISM) framework, increasing the total number of ISM projects from 6 to 10. These 4 projects involve an investment of approximately 46 billion rupees (approximately 3.777 billion yuan).

Among them, India's first commercial compound semiconductor wafer fab, built by SiCSem in cooperation with UK's Clas-SiC Wafer, has attracted much attention. The plant is located in the Information Valley of Bhubaneswar, the capital of Odisha, India, and will produce silicon carbide (SiC)-based wafers and devices, with a designed annual capacity of 60,000 wafers and 96 million devices.

Near the aforementioned silicon carbide wafer fab, a vertically integrated production base for advanced packaging technology and key material semiconductor-grade glass substrates will be built simultaneously. This project is undertaken by 3D Glass and will introduce glass interposers with passive devices and silicon bridges (Si Bridge), 3D heterogeneous integration (3DHI) module capacity, with a target annual output of 69,000 glass substrates, 13,200 3DHI modules, and 50 million assembly units.

In addition, ASIP will cooperate with South Korean company APACT to establish a semiconductor manufacturing plant in Andhra Pradesh. CDIL will expand its discrete semiconductor manufacturing plant in Punjab. The above 4 projects are expected to create a total of 2034 professional and technical personnel positions.

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