Ansemi Semiconductor (China) – Small‑Batch Mass Production of 12‑inch Wafer Bipolar Discrete Devices

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Industry News

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2026-03-10

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On March 9, onsemi (China) announced that, through its innovative “12‑inch platform” developed in-house, it has successfully achieved small‑batch production of 12‑inch wafer bipolar discrete devices. This milestone breakthrough not only signifies that onsemi (China) has reached a new level in its independent R&D and large‑scale production capabilities in the field of advanced specialty processes, but also means that it can now offer superior solutions—both in terms of performance, integration, and cost—for high‑end manufacturing across global consumer electronics, communications, automotive, and industrial control applications.

According to reports, on this occasion, AmSilicon (China) is producing small-batch 12‑inch wafer bipolar discrete devices—not merely by transplanting its existing 8‑inch products, but rather by leveraging its independently developed “12‑inch platform” to comprehensively optimize and restructure chip architecture, process integration, and manufacturing workflows.

Compared with traditional 8‑inch processes, bipolar discrete devices manufactured using 12‑inch wafers can produce nearly twice as many chips on a single wafer, significantly boosting production efficiency and raw material utilization while further reducing per-unit costs. Meanwhile, the technical team at NXP Semiconductors (China) has successfully achieved mass production of Schottky rectifiers on the “12‑inch platform” by optimizing existing process parameters, and these devices have smoothly passed AEC-Q101 automotive-grade standard certification for use in the automotive industry. Featuring a flat‑lead surface‑mount design, these devices combine a compact form factor with outstanding electrical performance, offering low forward voltage drop, low reverse recovery charge, low recovery current, and low leakage current. Coupled with advanced clip bonding technology, they ensure high power handling capability and reliability, making them an ideal choice for applications such as high‑efficiency DC‑DC converters, LED lighting, switch‑mode power supplies, freewheeling circuits, reverse‑polarity protection, and OR‑ing.

In addition, a new ESD protection device based on 12-inch wafer testing has also been successfully developed, offering optimized protection for transmission lines and effectively safeguarding against electrostatic discharge (ESD), inrush current, and short circuits. It is suitable for use in mobile phones, portable electronic devices, and more.

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