Changhua Technology’s projects in semiconductor packaging materials and precision molds have been signed in Weihai.

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Industry News

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2026-05-15

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On May 14, a signing ceremony was held for cooperative projects involving Changhua Technology’s semiconductor packaging materials and precision molds.

(Source: Weihai High-tech Zone Release)

According to an announcement from the Weihai High-tech Zone, Changhua Technology Co., Ltd. is a leading global supplier of semiconductor lead frames and has been deeply engaged in the semiconductor packaging materials sector for many years. The newly signed project—covering semiconductor packaging materials and precision molds—has a total investment of RMB 1 billion and will be located in the OA Electronic Technology Industrial Park within the Weihai High-tech Zone. It will establish Changhua Technology’s flagship production base in China, with operations focused on the research, design, manufacturing, and sales of lead-frame‑based semiconductor packaging materials, precision molds, and related products. This project signing marks a pivotal step in Changhua Technology’s efforts to deepen its global strategic footprint.

This project is a flagship initiative for Weihai High-tech Zone to accelerate the development of a semiconductor materials industry cluster. It holds significant strategic importance for attracting and clustering upstream and downstream supporting enterprises, strengthening the industrial chain, and optimizing the industrial layout. By integrating deeply with and synergizing with the zone’s existing leading industries, the project will help expedite the establishment of a modern “3+4” industrial system.

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