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SEMI Report: Forecasts 300mm fab equipment investment to exceed US$50 billion by 2026.
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Industry News
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Release time:
2026-07-01
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On June 29, 2026, U.S. Pacific Time, SEMI released its latest “300mm Fab Outlook Report” ( 300mm Fab Outlook It is noted that in 2026, global equipment investment in the 300mm wafer fab sector for the storage segment is expected to surpass US$50 billion for the first time, rising 29% to US$52 billion, and further increasing by 11% to US$57 billion in 2027. Supported by growing investments in AI infrastructure, data centers, and next-generation computing systems, this expansion reflects the sustained demand for advanced storage driven by AI.
Looking ahead, from 2024 to 2029, global equipment investment in the 300mm wafer fab segment for the memory sector is expected to grow at a compound annual growth rate (CAGR) of 19%. Meanwhile, worldwide 300mm memory production capacity is also projected to continue expanding, reaching 4.1 million wafers per month in 2026 and 4.2 million wafers per month in 2027.
SEMI President and CEO Ajit Manocha stated, “Strong demand for HBM and other advanced memory technologies is reshaping investment priorities across the entire semiconductor supply chain. As AI infrastructure expands, memory manufacturers are accelerating investments in capacity expansion and technology migration to support the next wave of data-intensive applications.”
Growth in the storage sector
SEMI’s “300mm Fab Outlook Report,” in its second-quarter 2026 edition, has revised upward its forecast for equipment spending in the 300mm fab memory segment, driven primarily by continued increases in capital expenditure plans among leading cloud service providers and robust demand for AI accelerators. Supported by strong demand for HBM and DDR5 from GPUs and other AI accelerators, DRAM equipment spending is expected to grow 29% year over year to US$37 billion in 2026. Meanwhile, buoyed by rising data‑storage needs spurred by AI deployments, 3D NAND equipment spending is also projected to rise 28% to US$14 billion in 2026.
Ongoing investments in advanced-node DRAM and higher‑layer 3D NAND are underpinning a more optimistic outlook for storage capacity, which has been revised upward in SEMI’s “300mm Fab Outlook Report,” Q2 2026 edition. However, due to technology transitions and process complexity—particularly the adoption of advanced-node DRAM, HBM, and higher‑layer NAND—effective capacity growth remains moderate.
SEMI’s “300mm Fab Outlook Report” covers 413 facilities and production lines worldwide. Compared with the previous edition, the report incorporates 155 updates and adds seven new fab or production line projects.
Source: SEMI
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