Total investment of RMB 20 billion: latest updates on the Silan Jihua project.

With the summer heat in full swing, construction is in full gear at the Silan (Xiamen) Semiconductor Industrial Park in Haicang. Recently, a reporter visited the site of the Silan Jihua 12-inch high-end analog integrated circuit project and observed that piling work on the southern plot has been fully completed, while basement floor slab and raft foundation construction is proceeding concurrently.

“We are making every effort to seize the construction window, and the project’s overall progress is on track to achieve key milestones three months ahead of schedule,” said Zhu Lirong, Chief Commander of the Xiamen Silan Project Command. He noted that Xiamen experiences frequent typhoons and severe convective thunderstorms during the summer, posing significant challenges to continuous concrete placement. In response, the project team has tailored its construction plan by erecting localized rain‑proof work shelters and deploying comprehensive emergency rain‑protection materials to ensure uninterrupted pouring operations. At the same time, they have implemented a day-and-night shift system and a 24‑hour rotating workforce of both personnel and equipment, striving to accelerate and enhance the quality of the project while firmly upholding safety and quality standards.

According to reports, the Silan Jihua 12-inch advanced analog integrated circuit project has a total investment of RMB 20 billion. The production line will benchmark against international cutting-edge standards, operate under an integrated design‑and‑manufacturing (IDM) model, and boast fully independent intellectual property rights.

The project is planned in two phases: Phase I, with an investment of RMB 10 billion, is scheduled to achieve initial line connectivity and commence production in the fourth quarter of next year, reaching full capacity by 2030 and generating 240,000 12-inch analog integrated circuit wafers annually. Phase II will involve an additional RMB 10 billion in investment. Upon completion of both phases, annual production capacity will increase to 540,000 wafers, effectively filling the domestic supply gap for critical chips in sectors such as automotive, industrial applications, large-scale servers, and robotics, thereby strongly supporting Xiamen’s efforts to become a leading hub for innovation and development in the integrated circuit industry.

Silan Micro is one of China’s leading integrated semiconductor design and manufacturing companies, focusing on the design, fabrication, and packaging of silicon‑based and compound‑semiconductor products. Its strategic direction aligns closely with Xiamen’s industrial development plan.

At present, Silan Micro has established three major manufacturing bases in Xiamen, with projects such as Silan Jike, Silan Mingjia, Silan Jihong, and Silan Jihua, thereby forming the “Silan Industrial Cluster” and the “Silan Industrial Park.” This has created a comprehensive industrial ecosystem, injecting strong momentum into Xiamen’s efforts to seize opportunities in emerging industries, accelerate industrial transformation and upgrading, and foster new‑type productive forces.

Leveraging the leading role of Silan Micro as a key enterprise, Haicang District has continuously deepened its efforts in business‑to‑business investment promotion and industrial‑chain‑based investment attraction. As a result, more than 70 upstream and downstream supporting companies—including Tongfu Microelectronics, Anjeli Meivi, Yuntian Semiconductor, and Zhongke Sihé—have established operations in the district. The overall output value of the industrial chain has approached RMB 10 billion, fostering a comprehensive industrial ecosystem characterized by synergistic development across specialty processes, packaging and testing, packaging substrates, and chip design.

Source: Xiamen Daily, Investing in Xiamen