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IPA Dryer
IPA Dryer
- Process Step
- Application area
- 介绍
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- Commodity name: IPA Dryer
Pure water + IPA + hot nitrogen drying
IPA steam drying uses chemical methods to replace water molecules on the wafer surface instead of mechanical force, so it is more friendly to fine feature structures and can avoid wafer damage caused by mechanical force.
Due to the volatility of IPA, it can evaporate quickly from the wafer surface, leaving a clean surface and avoiding water spots formed on the wafer during the drying process. Reduce particle contamination
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Suitable for cleaning semiconductor substrate materials and drying wafers after wet process
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IPA drying is a technology that uses IPA (isopropyl alcohol) to achieve dehydration and drying by heating, vaporization, and surface tension.
1. The wafer is cleaned in a chemical solution to remove surface contaminants.
2. The wafer is placed in a chamber filled with IPA vapor. In the chamber, the IPA vapor mixes with the chemical solution remaining on the surface of the wafer to form a mixture containing IPA and chemical solution.
3. The mixture evaporates from the surface of the wafer by heating or reducing the pressure, thereby drying the wafer.
4. The dried wafer is removed from the chamber for subsequent process steps.
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IPA drying is a technology that uses IPA (isopropyl alcohol) to achieve dehydration and drying by heating, vaporization, and surface tension.
1. The wafer is cleaned in a chemical solution to remove surface contaminants.
2. The wafer is placed in a chamber filled with IPA vapor. In the chamber, the IPA vapor mixes with the chemical solution remaining on the surface of the wafer to form a mixture containing IPA and chemical solution.
3. The mixture evaporates from the surface of the wafer by heating or reducing the pressure, thereby drying the wafer.
4. The dried wafer is removed from the chamber for subsequent process steps.
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