Process Technology

Jun 11,2025

MegaSonic cleaning technology is a highly efficient silicon wafer cleaning method that combines high-energy frequency vibration effects with the chemical reaction of chemical cleaning agents. This technology utilizes high-frequency sound waves of 0.8~1.0MHz to form high-speed micro-water streams in the cleaning solution, effectively removing contaminant particles smaller than 0.2μm from the wafer surface. It compensates for the shortcomings of traditional ultrasonic cleaning and combines the effects of mechanical scrubbing and chemical cleaning.

Key words:

Jun 09,2025

The principle of ultrasonic cleaning

Ultrasonic cleaning technology is primarily based on physical cleaning principles. This technology involves injecting cleaning agent into a cleaning tank and applying ultrasonic waves. As a mechanical vibration wave, the propagation of ultrasonic waves causes periodic changes in the sound pressure of the cleaning solution.

Key words:

Jun 06,2025

The working principle of a furnace tube cleaning machine

The wet equipment furnace tube cleaning machine effectively removes accumulated PSG/BSG, metal, and particulate contaminants from high-temperature furnace tubes through a precisely controlled process of chemical dissolution, high-efficiency fluid flushing, and physical drying.

Key words:

The working principle of a furnace tube cleaning machine

Jun 04,2025

The function of a fully automatic final cleaning machine

A fully automatic final cleaning machine is a device specifically designed for cleaning products or workpieces at the end of the manufacturing process.

Key words:

The function of a fully automatic final cleaning machine

May 30,2025

Working principle of wet etching machine

The working principle of the wet etching machine is based on the selective corrosion of materials by chemical solutions. Specifically, it uses various wet chemicals such as organic acids, inorganic acids, alkaline solutions, and bromine-based etchants (commonly referred to as etchants or corrosive solutions), which, through the principle of penetration etching, cause metal or semiconductor materials to dissolve (corrode) under the action of external forces (chemical energy).

Key words:

Working principle of wet etching machine

May 28,2025

Temperature and time for drying during wafer wet cleaning

In the wet cleaning process of wafers, the temperature and time of the drying step depend on several factors, including the drying method used, the nature of the cleaning solution, and the specific circumstances of the wafer.

Key words:

Temperature and time for drying during wafer wet cleaning

May 23,2025

Methods for improving the efficiency of wafer cleaning machines

As a key piece of equipment in semiconductor manufacturing, the wafer cleaning machine's cleaning efficiency directly impacts chip yield and production costs. With the continuous shrinking of semiconductor process nodes, the requirements for wafer surface cleanliness are becoming increasingly stringent, making the optimization of cleaning machine usage efficiency a key industry focus.

Key words:

Methods for improving the efficiency of wafer cleaning machines

May 21,2025

Technical Principles and Applications of Fully Automated Wafer Cleaning Machines

Fully automated wafer cleaning machines are one of the indispensable key pieces of equipment in the semiconductor manufacturing process. Their technological level and cleaning effectiveness directly affect the yield and performance of chips.

Key words:

Technical Principles and Applications of Fully Automated Wafer Cleaning Machines

May 19,2025

Pre-cleaning machine - a key step in ensuring chip quality

As semiconductor manufacturing processes become increasingly refined, chip cleanliness has become a core factor affecting product yield and reliability. Pre-cleaners, as key equipment in semiconductor manufacturing, effectively remove contaminants from the wafer surface through various technical means, laying the foundation for subsequent processes.

Key words:

Pre-cleaning machine - a key step in ensuring chip quality

May 16,2025

Key words:

Suggested maintenance methods for degumming cleaning machines

< 1...9 10 11...13 > proceed page

Technical Support Hotline

86-13861996325

E-MAIL:

sales@kosensemi.com

Technical Support Hotline: 86-13861996325

Address:

4th Floor, Building 5, No. 2 Haiyang South Road, Chengnan Street, Rugao City, Jiangsu Province

Subscribe to us for the latest updates

Mobile Station

WeChat Official Account

COOKIES

Our website uses cookies and similar technologies to personalize the advertising shown to you and to help you get the best experience on our website. For more information, see our Privacy & Cookie Policy

COOKIES

required

These cookies are necessary for basic functions such as payment. Standard cookies cannot be turned off and do not store any of your information.

analyze

These cookies collect information, such as how many people are using our site or which pages are popular, to help us improve the customer experience. Turning these cookies off will mean we can't collect information to improve your experience.

Feature

These cookies enable the website to provide enhanced functionality and personalization. They may be set by us or by third-party providers whose services we have added to our pages. If you do not allow these cookies, some or all of these services may not function properly.

advertise

These cookies help us understand what you are interested in so that we can show you relevant advertising on other websites. Turning these cookies off will mean we are unable to show you any personalized advertising.

Business License

KOSEN Blog.

COOKIES

COOKIES