Process Technology

May 12,2025

The role of silicon wafers in BOE etching process

Buffered oxide etch (BOE) is a commonly used wet etching technique in semiconductor manufacturing, primarily used to remove the oxide layer from the surface of silicon wafers. Silicon wafers, as the core material in the etching process, their properties and behavior directly affect the etching results.

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The role of silicon wafers in BOE etching process

May 10,2025

How are megahertz waves generated in a wafer cleaning machine?

Wafer cleaning is one of the key processes in semiconductor manufacturing, and its efficiency directly affects chip yield. This article analyzes the classification of wafer cleaning machines and the generation methods of megahertz sound waves, and explores the principles and optimization paths of tank-type, spray-type, and conformal megahertz sound wave technologies, combining the characteristics of immersion and rotary spray cleaning machines. By comparing the acoustic transmission efficiency and application scenarios of different technologies, this article provides a reference for the selection and process optimization of megahertz sound wave cleaning equipment.

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How are megahertz waves generated in a wafer cleaning machine?

May 07,2025

The working principle and importance of wafer cleaning machines

Wafer cleaning machines are crucial equipment in the semiconductor manufacturing industry. Their primary function is to remove contaminants from the wafer surface, ensuring the smooth progress of subsequent processes. This article will delve into the working principles of wafer cleaning machines and their importance in semiconductor production.

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The working principle and importance of wafer cleaning machines

Apr 30,2025

SPM cleaning process

SPM (sulfuric acid/hydrogen peroxide mixture) cleaning process is a common wet chemical cleaning method in semiconductor manufacturing, mainly used to remove organic contaminants (such as photoresist, grease) and inorganic contaminants (such as metal ions) from the surface of silicon wafers. Its core is to achieve efficient cleaning through the synergistic effect of the strong oxidizing properties of sulfuric acid and hydrogen peroxide.

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Apr 28,2025

CDS liquid supply system process technology

The Central Chemical Dispense System (CDS), as a core support system, uses automated control to achieve precise dispensing and recovery of chemicals, providing reliable assurance for wet processes in semiconductor manufacturing.

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CDS liquid supply system process technology

Apr 25,2025

Wafer processing using isopropyl alcohol (IPA) vapor drying

Isopropyl alcohol (IPA) vapor drying technology, due to its unique chemical properties, shows significant advantages in semiconductor wafer drying processes. This article briefly describes the chemical characteristics of IPA and analyzes the principles and operation process of its vapor drying process.

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Wafer processing using isopropyl alcohol (IPA) vapor drying

Apr 23,2025

CMP process and post-cleaning technology in semiconductor manufacturing

CMP is a crucial process in semiconductor manufacturing for achieving global planarization of wafer surfaces, and subsequent cleaning technology significantly impacts device performance and reliability. This article systematically describes the principles of CMP, the necessity of post-cleaning, and the main technical processes. It analyzes the mechanisms and advantages of mechanical cleaning, RCA cleaning, chemical dilution, and megasonic cleaning, and looks forward to future development directions.

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CMP process and post-cleaning technology in semiconductor manufacturing

Apr 21,2025

The Key Role and Development of Wafer Cleaning Technology in Semiconductor Manufacturing

Wafer cleaning technology is a core part of semiconductor manufacturing, removing various contaminants from the wafer surface to ensure chip yield, performance, and reliability. As semiconductor process nodes continue to advance to 3nm and below, cleaning technology faces greater challenges in terms of precision, environmental protection, and compatibility.

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The Key Role and Development of Wafer Cleaning Technology in Semiconductor Manufacturing

Apr 18,2025

Marangoni drying principle

Marangoni drying is a drying technique that uses surface tension gradients to drive liquid flow. Its principle is based on the Marangoni effect.

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Apr 16,2025

Design and principle analysis of a high-efficiency chip drying system based on the Marangoni effect

This article details the system's structural design, working principle, and its key role in optimizing drying efficiency, providing theoretical and technical references for high-precision semiconductor cleaning processes.

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Design and principle analysis of a high-efficiency chip drying system based on the Marangoni effect

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