Process Technology

Jul 16,2025

Troubleshooting methods for wafer cleaning machine control system

Wafer cleaning machines are mostly fully automated, which not only greatly facilitates use but also significantly improves production efficiency, effectively enhances product quality, and reduces the risk of recontamination. So, how should malfunctions in the wafer cleaning machine's control system be properly handled?

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Troubleshooting methods for wafer cleaning machine control system

Jul 11,2025

Comparison of ultrasonic and megahertz cleaning technologies

As semiconductor manufacturing process nodes continue to shrink to the nanometer level, the cleanliness requirements for wafer surfaces are becoming increasingly stringent. Traditional cleaning methods can no longer meet the requirements of advanced processes for controlling surface contaminants. Ultrasonic and megahertz ultrasonic cleaning technologies, as physical auxiliary cleaning methods, have demonstrated unique advantages in the semiconductor manufacturing field.

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Comparison of ultrasonic and megahertz cleaning technologies

Jul 09,2025

Semiconductor Cleaning: Processes, Methods, and Principles

Since the invention of the four basic processes of ion implantation, diffusion, epitaxial growth, and lithography in the 1950s, semiconductor manufacturing processes have continued to develop. Chips are extremely susceptible to particle and metal contamination during production, leading to failures such as short circuits or open circuits. Therefore, in addition to strictly preventing external contamination throughout the entire production process, wet or dry cleaning is required before and after key manufacturing steps such as high-temperature diffusion and ion implantation.

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Semiconductor Cleaning: Processes, Methods, and Principles

Jul 07,2025

EKC solution cleaning process

EKC solution cleaning is a crucial step in semiconductor manufacturing used to remove residues and contaminants from the wafer surface. The following is a detailed description of the EKC solution cleaning process:

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Jul 04,2025

Advantages of wet etching

What are the advantages of wet etching? High selectivity: Wet etching can achieve highly selective etching of the target material while having a relatively small impact on other materials.

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Jul 02,2025

Cleaning principles of SC1 and SC2

SC1 and SC2 are two commonly used wet cleaning processes in semiconductor manufacturing, primarily used to remove contaminants from the surface of silicon wafers. The cleaning principles are as follows:

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Jun 30,2025

Semiconductor wet process drying

Drying processes, as the final step in semiconductor wet cleaning, directly determine the quality of the wafer surface. This article systematically reviews the principles, equipment composition, and performance characteristics of mainstream technologies such as spin drying, IPA drying, Marangoni drying, slow pulling and infrared (IR) drying, and analyzes their applicable scenarios and limitations.

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Jun 27,2025

The difference between wet etching and wet cleaning in semiconductors

In semiconductor device manufacturing, wet etching and wet cleaning are two key wet chemical processes. Although both involve immersing the wafer in a chemical solution for processing, their process purposes and operating methods are different.

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The difference between wet etching and wet cleaning in semiconductors

Jun 25,2025

What are the different grades of PFA tubing?

PFA pipe grade

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What are the different grades of PFA tubing?

Jun 23,2025

Wet etching applications in semiconductors

Wet etching, a core process in microelectronics manufacturing, utilizes chemical etchants such as acids, bases, or solvents to react with the substrate material, generating soluble products to achieve selective material removal. Its process efficiency and precision directly affect the performance of integrated circuits, optical devices, and microelectromechanical systems (MEMS).

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Wet etching applications in semiconductors

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