News_KOSEN SEMI

Jul 10,2025

Team of Wang Xinqiang, Wang Ping, and Wang Tao from Peking University makes significant progress in the research of wurtzite nitride ferroelectric semiconductors

Recently, a team of researchers from Peking University, including Wang Xinqiang, Wang Ping, and Wang Tao from the Institute of Condensed Matter Physics and Materials Physics, the Wide Bandgap Semiconductor Research Center, the State Key Laboratory of Artificial Microstructures and Mesoscopic Physics, and the Frontier Science Center for Nano-optoelectronics, experimentally revealed the physical origin and control methods of the interfacial dead layer in wurtzite nitride ferroelectric semiconductors.

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Team of Wang Xinqiang, Wang Ping, and Wang Tao from Peking University makes significant progress in the research of wurtzite nitride ferroelectric semiconductors

Jul 09,2025

Semiconductor Cleaning: Processes, Methods, and Principles

Since the invention of the four basic processes of ion implantation, diffusion, epitaxial growth, and lithography in the 1950s, semiconductor manufacturing processes have continued to develop. Chips are extremely susceptible to particle and metal contamination during production, leading to failures such as short circuits or open circuits. Therefore, in addition to strictly preventing external contamination throughout the entire production process, wet or dry cleaning is required before and after key manufacturing steps such as high-temperature diffusion and ion implantation.

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Semiconductor Cleaning: Processes, Methods, and Principles

Jul 08,2025

Xihu Instruments: New breakthrough in ultra-thin single crystal diamond processing technology!

Recently, West Lake Instruments announced a breakthrough in the exfoliation technology of ultrathin single crystal diamond, successfully exfoliating ultrathin single crystal diamond flakes with a thickness of <100μm.

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Xihu Instruments: New breakthrough in ultra-thin single crystal diamond processing technology!

Jul 07,2025

EKC solution cleaning process

EKC solution cleaning is a crucial step in semiconductor manufacturing used to remove residues and contaminants from the wafer surface. The following is a detailed description of the EKC solution cleaning process:

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Jul 04,2025

Advantages of wet etching

What are the advantages of wet etching? High selectivity: Wet etching can achieve highly selective etching of the target material while having a relatively small impact on other materials.

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Jul 03,2025

The United States lifts EDA export restrictions on China!

On July 2, Synopsys announced that the US Department of Commerce has lifted its previous restrictions on the company's exports to China.

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The United States lifts EDA export restrictions on China!

Jul 02,2025

Cleaning principles of SC1 and SC2

SC1 and SC2 are two commonly used wet cleaning processes in semiconductor manufacturing, primarily used to remove contaminants from the surface of silicon wafers. The cleaning principles are as follows:

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Jul 01,2025

Ministry of Commerce responds to the Canadian government's closure of Hikvision's business in Canada

On June 30, a spokesperson for the Ministry of Commerce stated that Canada, citing "national security," forcibly shut down Hikvision's operations in Canada and prohibited Canadian government departments from purchasing or using Hikvision products. China strongly disapproves of and firmly opposes this.

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Ministry of Commerce responds to the Canadian government's closure of Hikvision's business in Canada

Jun 30,2025

Semiconductor wet process drying

Drying processes, as the final step in semiconductor wet cleaning, directly determine the quality of the wafer surface. This article systematically reviews the principles, equipment composition, and performance characteristics of mainstream technologies such as spin drying, IPA drying, Marangoni drying, slow pulling and infrared (IR) drying, and analyzes their applicable scenarios and limitations.

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Jun 27,2025

The difference between wet etching and wet cleaning in semiconductors

In semiconductor device manufacturing, wet etching and wet cleaning are two key wet chemical processes. Although both involve immersing the wafer in a chemical solution for processing, their process purposes and operating methods are different.

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The difference between wet etching and wet cleaning in semiconductors

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