News-KOSEN SEMI

Jan 21,2026

As the feature size of integrated circuits continues to shrink, the impact of chemical-mechanical polishing and subsequent cleaning processes in the back-end-of-line copper interconnect manufacturing on device performance and long-term reliability is becoming increasingly prominent.

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Jan 20,2026

With a total investment of 2 billion yuan, the 6-inch power chip project of Junxin Semiconductor is accelerating its progress.

According to a message from the “Zhunger Banner Release” official account, the advanced 6-inch silicon-based power chip project of Zhunxin Semiconductor has been under intensive construction for over a year, and the progress of the core cleanroom and specialized mechanical and electrical installation work has now exceeded half.

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With a total investment of 2 billion yuan, the 6-inch power chip project of Junxin Semiconductor is accelerating its progress.

Jan 19,2026

The variation pattern of the selectivity ratio between SiO₂ and Si₃N₄ in BOE buffer solution at different temperatures.

BOE buffer solution, with its controllable etching rate and excellent material selectivity, is commonly used in integrated circuit manufacturing for patterning and removing SiO2 layers.

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The variation pattern of the selectivity ratio between SiO₂ and Si₃N₄ in BOE buffer solution at different temperatures.

Jan 17,2026

Zhuhai’s first independently built 6-inch MEMS chip production line has been completed and put into operation.

On January 15, 2026, the first domestically built 6-inch MEMS chip production line in Zhuhai, invested and constructed by Yunji Xinguang (Zhuhai) Microelectronics Co., Ltd., was completed and put into operation in Jinwan District.

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Zhuhai’s first independently built 6-inch MEMS chip production line has been completed and put into operation.

Jan 16,2026

ESDA Report: Electronic System Design Industry Sales Reach $5.6 Billion in the Third Quarter of 2025

On January 12, 2026, Pacific Time in California, USA, the Electronic System Design Alliance (ESDA)—a technical community under SEMI—announced in its newly released “Electronic Design Market Data Report” (EDMD) that...

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ESDA Report: Electronic System Design Industry Sales Reach $5.6 Billion in the Third Quarter of 2025

Jan 15,2026

Post-etch cleaning

As the feature sizes of integrated circuits continue to shrink and three-dimensional structures become increasingly widespread, the importance of post-etch cleaning processes has grown significantly. Residues generated during etching not only affect the electrical performance of devices but can also lead to failures in subsequent process steps.

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Jan 14,2026

Yuanquan Semiconductor has successfully signed a long-term supply agreement with a leading inverter manufacturer.

Recently, Yuquan Semiconductor has received more good news! The company has successfully signed a long-term supply agreement for the years 2026-2028 with a leading domestic inverter manufacturer. The total order volume has exceeded 500,000 units, with a total value approaching RMB 70 million! This significant collaboration marks a substantial breakthrough in Yuquan Semiconductor’s strategic layout in the Central China market and lays a solid foundation for deeper cooperation between the two parties in the future.

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Yuanquan Semiconductor has successfully signed a long-term supply agreement with a leading inverter manufacturer.

Jan 09,2026

The Fundamentals and Reaction Mechanism of Wet Cleaning

In the semiconductor manufacturing process, contaminants on the wafer surface—including particles, organic substances, metal ions, and natural oxide films—can severely compromise device performance and reliability. Wet cleaning, which uses chemical solutions to regulate surface conditions at the nanoscale, not only removes these contaminants but also provides an ideal “starting point” for subsequent process steps such as thin-film deposition, photolithography, and etching.

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The Fundamentals and Reaction Mechanism of Wet Cleaning

Jan 08,2026

Eight departments jointly issued the "Implementation Opinions on the Special Action of 'Artificial Intelligence + Manufacturing'."

Recently, eight departments including the Ministry of Industry and Information Technology issued the "Implementation Opinions on the Special Action 'Artificial Intelligence + Manufacturing'." The document proposes that by 2027, China will have achieved a secure and reliable supply of key core technologies in artificial intelligence, and its industrial scale and empowerment capabilities will remain firmly among the world's top.

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Eight departments jointly issued the "Implementation Opinions on the Special Action of 'Artificial Intelligence + Manufacturing'."

Jan 07,2026

Temperature Control of SC-1 and SC-2 Solutions at Different Process Nodes

In semiconductor manufacturing, SC-1 (Standard Clean-1, an ammonia-hydrogen peroxide mixture) and SC-2 (Standard Clean-2, a hydrochloric acid-hydrogen peroxide mixture) are critical wet-etching cleaning processes. Temperature control for these processes must be finely optimized based on the process node, the type of contaminants, and the characteristics of the thin films, in order to ensure effective cleaning while minimizing damage to the device structure.

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Temperature Control of SC-1 and SC-2 Solutions at Different Process Nodes

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