News-KOSEN SEMI

Mar 09,2026

Application of the SC2 Wet Etching Process

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Mar 06,2026

Comparison of Wet-Process and Dry-Process Chip Manufacturing Techniques

By comparing wet etching processes and dry etching processes in chip manufacturing—including aspects such as etching methods, process uniformity, cost structure, and application fields—we can identify their key differences.

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Comparison of Wet-Process and Dry-Process Chip Manufacturing Techniques

Mar 05,2026

Guo Yufeng, a member of the National Committee of the Chinese People's Political Consultative Conference, says that domestically produced chips are accelerating their upgrade, making the leap from merely usable to truly user-friendly.

“At this year’s Two Sessions, I’ll bring a new business laptop powered by domestically produced chips.”

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Guo Yufeng, a member of the National Committee of the Chinese People's Political Consultative Conference, says that domestically produced chips are accelerating their upgrade, making the leap from merely usable to truly user-friendly.

Mar 02,2026

NMP wet-process technology

The NMP wet-etching process leverages the properties of a highly polar, aprotic solvent to dissolve thick photoresist, etched fluorocarbon polymers, and residual hard-shell layers from ion implantation through thermal soaking at 70–90℃. It is a critical post-processing step for removing photoresist. Combined with rinsing and residue-free drying, this process achieves high cleanliness and process consistency, ensuring the stability and reliability of subsequent manufacturing steps.

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Feb 27,2026

ASML says its next-generation EUV equipment is now ready for mass production, marking a critical turning point for AI chip manufacturing.

According to Reuters, an ASML executive revealed that the company’s next-generation chip-manufacturing equipment is now ready, and chipmakers can begin mass production.

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ASML says its next-generation EUV equipment is now ready for mass production, marking a critical turning point for AI chip manufacturing.

Feb 03,2026

Shanghai: Vigorously cultivate and develop future industries such as fourth-generation semiconductors.

The fourth session of the 16th Shanghai Municipal People's Congress opened on the morning of February 3 at the Expo Center.

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Shanghai: Vigorously cultivate and develop future industries such as fourth-generation semiconductors.

Feb 02,2026

Introduction to Wafer Cleaning Equipment

After undergoing multiple manufacturing steps, wafers often have their surfaces contaminated by a large number of particles composed of polymers, photoresists, and etching residues. These particles and impurities can severely affect the geometric features and electrical performance of chips in subsequent processing steps.

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Introduction to Wafer Cleaning Equipment

Jan 30,2026

Jingce Electronics has completed construction of its 12-inch advanced packaging R&D line and has begun investing in the expansion project for its Shanghai Phase II laboratory.

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Jan 26,2026

Intel is announcing that glass substrate technology has now entered mass production.

Recently, Intel announced that its glass-substrate technology has reached high-volume manufacturing (HVM). At the heart of this technology is Intel’s advanced facility located in Chandler, Arizona, which represents one of the most significant transformations in the semiconductor packaging field in nearly three decades.

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Intel is announcing that glass substrate technology has now entered mass production.

Jan 22,2026

Total investment of 25.2 billion yuan! The Guangdong Xinxin Semiconductor 480,000-wafer-per-year production line project is launched.

On January 22, the launch ceremony for the fourth-phase project of Yuexin Semiconductor was held in Huangpu District, Guangzhou.

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Total investment of 25.2 billion yuan! The Guangdong Xinxin Semiconductor 480,000-wafer-per-year production line project is launched.

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