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Final Cleaning Machine
Final Cleaning Machine
- Process Step
- Application area
- 介绍
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- Commodity name: Final Cleaning Machine
Compatible with 6/8-inch cassette types.
- STEP 1：DHF cleaning tank
- STEP 2：OF trough
- STEP 3：SC-1 trough
- STEP 4：QDR trough
- STEP 5：SC-2 trough
- STEP 6：QDR trough
- STEP 7：Drying tank
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The final cleaning machine is specifically designed for cleaning products or workpieces at the end of the manufacturing process.
It is used across multiple industries, particularly in semiconductor, electronics, and machining sectors.
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With a LOAD and UNLOAD system for efficient loading and unloading, it performs dry in, dry out cleaning, capable of processing up to 50 cassettes per batch. The machine includes three process tanks, three water tanks and a drying unit.
This machine is used for cleaning silicon wafers before shipment, ensuring the surface meets the customer’s quality standards by completely removing contaminants such as metals, particles, and organic substances.
Equipment Functions:
Chemical BATH: Automatic acid change, automatic tank washing, automatic chemical mixture within the tank.
DIW BATH: Pre Flow and After Change Function。
DIW BATH: Pre-flow and after-change functions.
S/D: Automatic conversion for 6/8-inch wafers, with spin drying.
Robotic Arm: Chuck open/close type with adjustable speed.
Scheduler: Schedule calculation enables simultaneous cleaning of multiple batches without exceeding process time.
Safety: Interlock safety features for door, temperature, level, exhaust, and more.
Equipment Process Flow:
●Loading Area (LOAD) → DHF (100:1) → OF Tank → SC-1 Tank →QDR Tank →SC-2 Tank→QDR Tank →S/D Tank → Unloading
●High WPH Type: AWB200-T. Dual cassette, 50 cassettes per tank.
●Compatible with 6/8-inch cassette types
●Front-mounted robotic arms: ARM-1, ARM-2, ARM-3, three sets in total.
●The machine is equipped with a high-efficiency filter (FFU) at the top.
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With a LOAD and UNLOAD system for efficient loading and unloading, it performs dry in, dry out cleaning, capable of processing up to 50 cassettes per batch. The machine includes three process tanks, three water tanks and a drying unit.
This machine is used for cleaning silicon wafers before shipment, ensuring the surface meets the customer’s quality standards by completely removing contaminants such as metals, particles, and organic substances.
Equipment Functions:
Chemical BATH: Automatic acid change, automatic tank washing, automatic chemical mixture within the tank.
DIW BATH: Pre Flow and After Change Function。
DIW BATH: Pre-flow and after-change functions.
S/D: Automatic conversion for 6/8-inch wafers, with spin drying.
Robotic Arm: Chuck open/close type with adjustable speed.
Scheduler: Schedule calculation enables simultaneous cleaning of multiple batches without exceeding process time.
Safety: Interlock safety features for door, temperature, level, exhaust, and more.
Equipment Process Flow:
●Loading Area (LOAD) → DHF (100:1) → OF Tank → SC-1 Tank →QDR Tank →SC-2 Tank→QDR Tank →S/D Tank → Unloading
●High WPH Type: AWB200-T. Dual cassette, 50 cassettes per tank.
●Compatible with 6/8-inch cassette types
●Front-mounted robotic arms: ARM-1, ARM-2, ARM-3, three sets in total.
●The machine is equipped with a high-efficiency filter (FFU) at the top.
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Technical Support Hotline
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Technical Support Hotline: 86-13861996325
Address:
4th Floor, Building 5, No. 2 Haiyang South Road, Chengnan Street, Rugao City, Jiangsu Province
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