Industry News_KOSEN SEMI

Jul 24,2025

New historical high! SEMI predicts that the total global semiconductor equipment sales will reach US$125.5 billion in 2025

On July 22, 2025, California time, SEMI's Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective indicated that total global semiconductor manufacturing equipment sales by original equipment manufacturers (OEMs) are expected to reach a record high of $125.5 billion in 2025, a year-over-year increase of 7.4%. Driven by continued advancements in logic, memory, and technology migration, equipment sales are expected to further climb to $138.1 billion in 2026, marking three consecutive years of growth.

Key words:

New historical high! SEMI predicts that the total global semiconductor equipment sales will reach US$125.5 billion in 2025

Jul 22,2025

Guangdong Zhi Neng: Global debut of silicon-based vertical GaN HEMT power device technology

The Guangdong ZhiNeng team has achieved a global first in the direct epitaxial growth of vertical GaN/AlGaN heterostructures and vertical two-dimensional electron gas (2DEG) channels on silicon substrates. Through precise process control, they have fabricated gallium nitride fin structures with low dislocation density. This method offers a high degree of freedom in epitaxial structure design.

Key words:

Guangdong Zhi Neng: Global debut of silicon-based vertical GaN HEMT power device technology

Jul 17,2025

Professor Wang Xinran's team at Nanjing University achieves new progress in wafer-scale two-dimensional semiconductor stacking control: Nature Materials

A research team led by Professor Wang Xinran from Nanjing University published their findings online in Nature Materials, marking a significant new advance in the controllable preparation of two-dimensional materials and bringing new opportunities for multifunctional heterogeneous integration of two-dimensional materials.

Key words:

Professor Wang Xinran's team at Nanjing University achieves new progress in wafer-scale two-dimensional semiconductor stacking control: Nature Materials

Jul 15,2025

The US Department of Commerce has launched investigations into imports of polysilicon and drones.

A notice released by the US Department of Commerce on Monday shows that the Trump administration has begun investigating the import of a semiconductor material and unmanned aircraft systems (UAS) to determine their impact on US national security.

Key words:

The US Department of Commerce has launched investigations into imports of polysilicon and drones.

Jul 10,2025

Team of Wang Xinqiang, Wang Ping, and Wang Tao from Peking University makes significant progress in the research of wurtzite nitride ferroelectric semiconductors

Recently, a team of researchers from Peking University, including Wang Xinqiang, Wang Ping, and Wang Tao from the Institute of Condensed Matter Physics and Materials Physics, the Wide Bandgap Semiconductor Research Center, the State Key Laboratory of Artificial Microstructures and Mesoscopic Physics, and the Frontier Science Center for Nano-optoelectronics, experimentally revealed the physical origin and control methods of the interfacial dead layer in wurtzite nitride ferroelectric semiconductors.

Key words:

Team of Wang Xinqiang, Wang Ping, and Wang Tao from Peking University makes significant progress in the research of wurtzite nitride ferroelectric semiconductors

Jul 08,2025

Xihu Instruments: New breakthrough in ultra-thin single crystal diamond processing technology!

Recently, West Lake Instruments announced a breakthrough in the exfoliation technology of ultrathin single crystal diamond, successfully exfoliating ultrathin single crystal diamond flakes with a thickness of <100μm.

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Xihu Instruments: New breakthrough in ultra-thin single crystal diamond processing technology!

Jun 26,2025

Donghu High-tech Zone joins hands with Changjiang Industry Group: Building a foundation for financial empowerment, accelerating the deep integration of technological innovation and industry

On the afternoon of June 25, the Management Committee of Donghu High-tech Development Zone and Changjiang Industry Group signed a strategic cooperation agreement. Shen Yue, member of the Standing Committee of the Municipal Party Committee and secretary of the Party Working Committee of Donghu High-tech Development Zone, and Li Yuanyu, secretary of the Party Committee and chairman of Changjiang Industry Group, attended the event and witnessed the signing ceremony. Lu Yuqing, director of the Management Committee of Donghu High-tech Development Zone, and Zhou Yongshi, general manager of Changjiang Industry Group, signed on behalf of both parties.

Key words:

Donghu High-tech Zone joins hands with Changjiang Industry Group: Building a foundation for financial empowerment, accelerating the deep integration of technological innovation and industry

Jun 24,2025

TSMC is actively planning 2nm production capacity, aiming for a monthly production capacity of 200,000 wafers by the end of 2028.

TSMC's 2nm process is expected to reach mass production, with a monthly production capacity of 200,000 wafers by the end of 2028.

Key words:

TSMC is actively planning 2nm production capacity, aiming for a monthly production capacity of 200,000 wafers by the end of 2028.

Jun 19,2025

Application of silicon carbide diamond heatsink in GaN power amplifier

Recently, a research paper titled "Application of Silicon-Based Diamond Heatsink in GaN Power Amplifier" was published in the core domestic semiconductor journal "Semiconductor Technology." The paper, authored by researchers from Henan Kezhicheng Third-Generation Semiconductor Carbon-Based Chip Co., Ltd., systematically studies, simulates, and verifies the thermal management effect of silicon-based diamond materials on GaN radio frequency power amplifier devices.

Key words:

Application of silicon carbide diamond heatsink in GaN power amplifier

Jun 17,2025

Chinese researchers have filled the gap in non-destructive testing technology for micro-LED wafers with their 'soft-and-gentle' approach.

Mini-LEDs are core components of next-generation high-end display technology. Wafers equipped with mini-LEDs must achieve 100% yield; otherwise, it will lead to huge repair costs for end products. However, the industry has not yet found a good method for non-destructive testing of wafers through contact. Recently, Chinese researchers have filled this technological gap using a 'soft overcomes hard' approach.

Key words:

Chinese researchers have filled the gap in non-destructive testing technology for micro-LED wafers with their 'soft-and-gentle' approach.

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