Industry News_KOSEN SEMI

Jun 26,2025

Donghu High-tech Zone joins hands with Changjiang Industry Group: Building a foundation for financial empowerment, accelerating the deep integration of technological innovation and industry

On the afternoon of June 25, the Management Committee of Donghu High-tech Development Zone and Changjiang Industry Group signed a strategic cooperation agreement. Shen Yue, member of the Standing Committee of the Municipal Party Committee and secretary of the Party Working Committee of Donghu High-tech Development Zone, and Li Yuanyu, secretary of the Party Committee and chairman of Changjiang Industry Group, attended the event and witnessed the signing ceremony. Lu Yuqing, director of the Management Committee of Donghu High-tech Development Zone, and Zhou Yongshi, general manager of Changjiang Industry Group, signed on behalf of both parties.

Key words:

Donghu High-tech Zone joins hands with Changjiang Industry Group: Building a foundation for financial empowerment, accelerating the deep integration of technological innovation and industry

Jun 24,2025

TSMC is actively planning 2nm production capacity, aiming for a monthly production capacity of 200,000 wafers by the end of 2028.

TSMC's 2nm process is expected to reach mass production, with a monthly production capacity of 200,000 wafers by the end of 2028.

Key words:

TSMC is actively planning 2nm production capacity, aiming for a monthly production capacity of 200,000 wafers by the end of 2028.

Jun 19,2025

Application of silicon carbide diamond heatsink in GaN power amplifier

Recently, a research paper titled "Application of Silicon-Based Diamond Heatsink in GaN Power Amplifier" was published in the core domestic semiconductor journal "Semiconductor Technology." The paper, authored by researchers from Henan Kezhicheng Third-Generation Semiconductor Carbon-Based Chip Co., Ltd., systematically studies, simulates, and verifies the thermal management effect of silicon-based diamond materials on GaN radio frequency power amplifier devices.

Key words:

Application of silicon carbide diamond heatsink in GaN power amplifier

Jun 17,2025

Chinese researchers have filled the gap in non-destructive testing technology for micro-LED wafers with their 'soft-and-gentle' approach.

Mini-LEDs are core components of next-generation high-end display technology. Wafers equipped with mini-LEDs must achieve 100% yield; otherwise, it will lead to huge repair costs for end products. However, the industry has not yet found a good method for non-destructive testing of wafers through contact. Recently, Chinese researchers have filled this technological gap using a 'soft overcomes hard' approach.

Key words:

Chinese researchers have filled the gap in non-destructive testing technology for micro-LED wafers with their 'soft-and-gentle' approach.

Jun 12,2025

Indy Semiconductor's automotive-grade control chips have accumulated shipments exceeding 300 million units for pre-installation.

Inndy Semiconductor officially announced on June 11 that its cumulative shipments of automotive-grade control chips for pre-installation have exceeded 300 million.

Key words:

Indy Semiconductor's automotive-grade control chips have accumulated shipments exceeding 300 million units for pre-installation.

Jun 10,2025

Jixin Silicon's 12-inch polishing wafer officially goes online

On June 7, Lishui Xinxin Wafer Semiconductor Materials Co., Ltd. in Lishui, Zhejiang held a ceremony to celebrate the launch of its 12-inch polishing wafer production line, marking the official mass production of the city's first batch of 12-inch polishing wafers in the Lishui Economic Development Zone.

Key words:

Jixin Silicon's 12-inch polishing wafer officially goes online

Jun 05,2025

The Ministry of Industry and Information Technology has launched a special study to promote the development of the artificial intelligence industry and empower new industrialization

On June 3, Li Lecheng, Party Secretary and Minister of the Ministry of Industry and Information Technology, presided over a meeting to deeply study and implement the spirit of General Secretary Xi Jinping's important instructions and directives on artificial intelligence, implement major decisions and arrangements of the CPC Central Committee and the State Council, and research ideas and measures to promote the development of the artificial intelligence industry and empower new industrialization. Ministry leaders Ye Min, Xiong Jijun, Shan Zhongde, Xie Yuansheng, and Xie Shaofeng attended the meeting and delivered speeches.

Key words:

The Ministry of Industry and Information Technology has launched a special study to promote the development of the artificial intelligence industry and empower new industrialization

Jun 03,2025

US announces extension of partial exemptions for Section 301 tariffs on China

On May 31, local time, the United States Trade Representative (USTR) announced an extension of tariff exclusions for certain products under the Section 301 investigation into China's acts, policies, and practices concerning technology transfer, intellectual property, and innovation. These exclusions, originally set to expire on May 31, 2025, have now been extended until August 31, 2025.

Key words:

US announces extension of partial exemptions for Section 301 tariffs on China

May 29,2025

A seminar on Sino-European semiconductor industry chain cooperation was held in Beijing to discuss deepening economic and trade cooperation in the semiconductor field between China and Europe.

On May 27, a symposium on semiconductor industry cooperation between China and Europe was held in Beijing, where discussions focused on deepening economic and trade cooperation in the semiconductor field.

Key words:

A seminar on Sino-European semiconductor industry chain cooperation was held in Beijing to discuss deepening economic and trade cooperation in the semiconductor field between China and Europe.

May 27,2025

GlobalWafers Chairman: Future expansion of 12-inch silicon wafer production capacity

GlobalWafers held its annual shareholders' meeting on May 26. Chairperson Hsu Hsiu-lan provided a detailed outlook for 2025, projecting that operational performance in 2025 will surpass that of 2024. Hsu stated that continued customer inventory destocking has improved the inventory situation, laying a foundation for the company's future development.

Key words:

GlobalWafers Chairman: Future expansion of 12-inch silicon wafer production capacity

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